| 姓名 |
楊昌修(Chang-hsiu Yang)
查詢紙本館藏 |
畢業系所 |
工業管理研究所在職專班 |
| 論文名稱 |
十二吋晶圓廠自動化搬運系統規劃與導入—以A公司為例
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| 相關論文 | |
| 檔案 |
 [Endnote RIS 格式]
[Bibtex 格式]
 [相關文章]  [文章引用]  [完整記錄]  [館藏目錄]  至系統瀏覽論文 ( 永不開放)
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| 摘要(中) |
近年來在全球競爭逐漸白熱化之情況下，半導體廠為了提昇公司競爭力，無不全力增加十二吋晶圓廠的設立，藉以提高產量並降低生產成本。而自動化搬運系統的效率便成為其中最重要的一環。相較於八吋晶圓廠，十二吋的自動搬運系統，不論在軟體或硬體的規劃與設計，所考慮的因素都更為完整與詳細。
本研究將以規劃者之角度，針對十二吋搬運系統的規劃程序與模擬方法來探討如何才能規劃出一個高效能的自動化搬運系統。本研究更以實例來說明AutoMod這套模擬軟體在建構Interbay/Intrabay系統模型的過程，此外亦考量系統之控制邏輯等功能。
因本研究以個案研究的方式進行討論，尚無足夠證據作為廣泛性推論，但已能提供往後相關研究的研究參考；本研究在分析案例中的規劃程序時，並未考慮企業營運策略及財務與企業大小等問題。 |
| 摘要(英) |
In recent years situation of the global competition is getting obvious and semiconductor factories in order to promote the company competitive abilities which increase twelve inches semiconductors established to enhance the output in order to reduce the production cost. However the automated transporting system efficiencies will become the most important link. Compares to eight inches with twelve inches automatic transporting system, the latter one no matter the software or the hardware which plan and the design are better than the former. And twelve inches semiconductors consider factors are also more details and complete.
This research will be the planer views, to conduct how to plan a high efficiency automated transporting system from scheming out the procedures and the methods of simulation. The example in this research showed the AutoMod this set of software which simulation constructing constructs of Interbay/Intrabay system model’s process, in addition also considers system functions and control logic.
This research carried on the discussion by the case study way, but not has enough proofs to be extensive inferences. However it also able to provide the research reference for the future studies. For this case study, analysis it planned procedures but did not consider business strategies、finances and the enterprise sizes. |
| 關鍵字(中) |
★ 十二吋晶圓廠自動化搬運系統 |
關鍵字(英) |
★ 300mm fab AMHS System Planning and Implementatio |
| 論文目次 |
中文摘要........................................................................................I
ABSTRACT….............................................................................II
目錄………………………………….........................................III
表目錄…………………………………………………………...V
圖目錄…………………………...……………………………..VI
第一章、緒論…………..………………………………………...1
1.1. 研究背景………………….…………………………….1
1.2. 研究動機……………………….……………………….2
1.3. 研究目的..........................................................................2
1.4. 研究範圍與對象..............................................................3
1.5. 論文架構..........................................................................4
第二章、文獻回顧 ………………………………………………5
2.1. 自動化搬運系統的組成..................................................5
2.2. 自動化搬運系統的演進..................................................8
2.3. 十二吋晶圓廠自動搬運系統的優勢............................10
2.4. DRAM產業現況與未來發展…………………………11
第三章、個案公司介紹 ………………………………………15
3.1. 個案A公司背景介紹...................................................15
3.2. 半導體廠自動化系統市場分析....................................20
第四章、研究方法 ……………………………………………23
4.1. AutoMod之介紹與應用.................................................23
4.2. 自動化系統之規劃程序................................................26
4.3. 自動化搬運系統之控制邏輯........................................31
4.4. 模擬結果的檢討與說明................................................39
第五章、結論與建議 …………………………………………45
5.1. 個案公司之建議與改善措施........................................45
5.2. 結論與未來研究方向....................................................47
參考文獻 …………………………………………….……...…48 |
| 參考文獻 |
英文部分
1. Kaempf , U., “Automated Wafer Transport in the Wafer Fab“, Advanced
IEEE/SEMI Semiconductor Manufacturing Conference, 1997.
2. Mittler, M. and A.K. Schoemig, “Comparison of Dispatching Rules for
Semiconductor Manufacturing Using Large Facility Models”, Proceedings of
Winter Simulation Conference, 1999.
3. Weiss, M. “300 mm Tool Automation and its impact on Fab Design and OEE”,
IEEE/SEM Advanced Semiconductor Manufacturing Conference, 1996.
4. Batri , N. J. Reiss and B. Doherty, “A Comparison of Unified v.s.Segregated
Automated Material Handling Systems for 300 mm Fabs”, IEEE/SEMI International
Symposium on Semiconductor Manufacturing, 2001.
5. Gaxiola , G. L. Hennessy, “Evaluation of Advantages of Integrating 300mm AMHS
Fab Layouts in the Photo Area”, IEEE International Semiconductor Manufacturing
Symposium, 2001.
6. Fu , H.S. and D.Y. Liao, “An Effective OHT Dispatch Policy for 300 mm AMHS
Management”, Proceedings of 2001 SEMICON Taiwan, 2001.
7. Kurosaki, R. N. Nagao, H. Komada, Y. Watanabe, H. Yano, “AMHS for 300mm
Wafer”, IEEE International Symposium on Semiconductor Manufacturing
Conference Proceedings, 1997.
8. Peters, B.A. and T. Yang, “Integrated Facility Layout and Material Handling System
Design in Semiconductor Fabrication Facilities”, IEEE Transactions on
Semiconductor Manufacturing, 1997.
9. Weiss, M. “New Twists on 300 mm Fab Design and Layout”, Semiconductor
International, 1999.
10. Nadoli , G. and D. Pillai, “Simulation In Automated Material Handling Systems
Design For Semiconductor Manufacturing”, Proceedings of Winter Simulation
Conference, 1996.
中文部分
1. 陳紹偉，「12吋IC代工廠自動搬運系統之系統模擬與派工法則的研究」，
國立台灣大學機械工程研究所碩士論文，民國88年。
2. 王朝龍，「十二吋晶圓廠OHT控制系統之設計與開發」，長庚大學機械工
程研究所碩士論文，民國90年。
3. 周上傑，「晶圓廠自動化物料搬運系統之派車模擬研究」，國立清華大學
工業工程研究所碩士論文，民國88年。
4. 顏炳榮，「半導體晶圓廠自動化物料搬運系統之模擬研究」，國立清華大學
工業工程研究所碩士論文，民國88年。
5. 哈建宇，「半導體廠自動化系統市場分析」，工研院IEK-ITIS計畫，民國93年。 |
| 指導教授 |
何應欽(Ying-Chin Ho)
|
審核日期 |
2008-1-14 |
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