| 姓名 |
鄭俊仁(Chun-Jen Cheng)
查詢紙本館藏 |
畢業系所 |
工業管理研究所在職專班 |
| 論文名稱 |
建立中小型印刷電路板企業品質改善標準流程
(Establish Quality Improvement Standard Process For Small And Medium Printed Circuit Board Enterprise)
|
| 相關論文 | |
| 檔案 |
 [Endnote RIS 格式]
[Bibtex 格式]
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| 摘要(中) |
印刷電路板在科技產品中是一項重要基礎，科技產品必須將許多電子零組件及晶片裝置在印刷電路板上，因此印刷電路板的好壞也牽動科技產品的品質及壽命。隨著全世界科技產品汰換的速度快速，印刷電路板企業面臨各大客戶不斷要求提升產品品質與交貨速度，無疑對印刷電路板企業是一項大挑戰，然而對於台灣的中小企業來說，要在如此競爭的環境中，不但要面對相同產業的龍頭企業優勢搶單，甚至龍頭企業不惜削價競爭或免費提供換貨來保證產品品質，再加上客戶的高要求及國際大廠的價格戰及研發戰，要在夾縫中提升競爭力及提升毛利更是一項艱鉅的任務。
本研究個案公司為中小型企業，在其預算及訂單不但無法像大企業馬上跟進資金運作，技術、人力、設備產能也無法快速到位，這些資源有限的中小企業，藉由提升產品品質以期降低報廢品金額來間接提升公司獲利對中小企業是相對容易做到的。品管圈是早期為了解決許多製造業工廠問題應運而生，由於改善的效果顯著，品管圈活動也開始廣泛被學校、醫院、及其他私人機構運用。但隨著企業間競爭日益增強，為了更廣泛的應用其觀念到其他企業面臨的問題，品管圈也從早期侷限在企業相同部門、基層員工成員、小規模的特性，轉變成跨部門性質的品管圈活動，稱為QIT方法。
本研究以具有跨部門性質的QIT為主要流程架構，先運用柏拉圖找出最頻繁發生的品質缺點，並透過與製造部、製程部、設備部、品質保證部人員腦力激盪出特性要因圖中的人、機、料、法中各項要因，並驗證各項要因是否為真正原因。最後透過推移圖確認執行改善對策前，防焊漆面露銅缺點比率約為0.300%，但是在執行對策之後的防焊漆面露銅缺點比率就迅速降到0.150%以下，而且連續四周都維持在0.150%以下，故在防焊漆製程中紫外光烘烤機台內部傳送帶交接處貼上工業用的黏塵紙，並每天更換該黏塵紙的對策是有效的。透過這一連串的品質改善執行步驟及方法，確實可以提升個案公司的產品品質，當然一間工廠的品質沒有最好只有更好，故可以將這一連串的執行手法不斷的運用到其他品質缺點上，確保工廠的品質不斷提升。 |
| 摘要(英) |
Printed circuit boards are an important foundation in technology products. Technology products must have many electronic components and chips mounted on the printed circuit board. Therefore, the quality of the printed circuit board also affects the quality and life of the technology product. With the rapid replacement of technological products around the world, printed circuit board companies are facing constant demands from major customers to improve product quality and delivery speed. This is undoubtedly a big challenge for printed circuit board companies, but for small and medium-sized enterprises in such a competitive environment in Taiwan, not only have to face the advantages of leading companies in the same industry to grab orders, but even leading companies will not hesitate to decline prices or provide free replacements to ensure product quality, coupled with high customer requirements and international manufacturers’ price and developing competitiveness.
The company in this case study is a small and medium-sized enterprise. In its budget and orders, not only it cannot follow up the capital operation immediately like a large enterprise, but the technology, manpower, and equipment production capacity cannot be quickly put in place. These small and medium-sized enterprises with limited resources can improve product quality in order to reduce waste. It is relatively easy for medium-sized enterprise to indirectly increase the profitability of the company by using the amount of scrapped products. The quality control circle came into being in the early stage to solve the problems of many manufacturing factories. Due to the significant improvement effect, the quality control circle activities have also begun to be widely used by schools, hospitals, and other private organizations. However, with the increasing competition among enterprises, in order to apply its concepts more widely to the problems faced by other enterprises, the quality control circle has also changed from being limited to the same department, grassroots staff members, and small-scale characteristics of the enterprise to a cross-departmental nature. It called QIT method.
This research uses QIT method, which has a cross-departmental nature, as the main process architecture. First, Plato method is used to find the most frequently occurring quality defects, and through brainstorming with the person of the manufacturing department, process department, equipment department, and quality assurance department Various factors in people, machine, material, and method, and verify whether each factor is the real cause. Finally, it was confirmed through the transition diagram that the defect rate of copper exposed on the solder resist paint surface was about 0.300% before the improvement measures were implemented, but after the measures were implemented, the defect rate of copper exposed on the solder resist paint surface quickly dropped below 0.150% and maintained for four consecutive weeks. Below 0.150%, it is effective to stick industrial sticky paper at the intersection of the conveyor belt inside the UV baking machine during the solder resist paint process, and replace the sticky paper every day. Through this series of quality improvement execution steps and methods, the product quality of the individual company can indeed be improved. Of course, the quality of a factory is not the best but better. Therefore, this series of execution methods can be continuously applied to other quality shortcomings. Ensure the continuous improvement of the quality of the factory. |
| 關鍵字(中) |
★ 印刷電路板
★ 品質改善小組
★ 柏拉圖
★ 特性要因圖
★ 推移圖 |
關鍵字(英) |
★ Printed Circuit Board
★ Quality Improvement Team
★ Plato Diagram
★ Characteristic Diagram
★ Trend Chart |
| 論文目次 |
摘要 i
Abstract iii
誌謝 vi
目錄 vii
圖目錄 ix
表目錄 x
第一章 緒論 1
1.1 研究背景 1
1.2 研究目的 1
1.3 論文架構 2
第二章 研究問題 3
2.1 印刷電路板產業 3
2.2 製程介紹 6
2.3 研究動機 10
2.4 研究問題 11
第三章 文獻探討 13
3.1 常見品質問題 13
3.2 管控品質工具 14
3.3 品質改善小組 16
第四章 研究方法 19
4.1 品質改善小組 19
4.2 品質改善方法 21
第五章 個案研究 26
5.1 個案背景及現況 26
5.2 尋找防焊漆面露銅缺點真因並改善 29
5.3 改善防焊漆面露銅效果確認及標準化 32
5.4 研究重要發現及心得 35
第六章 研究總結 37
6.1 研究總結 37
6.2 後續研究 38
參考文獻 39 |
| 參考文獻 |
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英文文獻
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| 指導教授 |
王啟泰(Chi-Tai Wang)
|
審核日期 |
2021-7-21 |
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