Effective charge number of Cu in Cu-Sn compound

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题名:	Effective charge number of Cu in Cu-Sn compound
作者:	劉正毓;Lu, C. T.;Hu, Y. J.;Liu, Y. S.;Huang, T. S.;Tseng, H. W.;Chen, C. Y.;Liu, C. Y.
贡献者:	工學院化學工程與材料工程學系
日期:	2012-12-01
上传时间:	2026-04-21 14:03:22 (UTC+8)
出版者:	The Electrochemical Society
摘要:	摘要： As current-stressing a Cu/Sn joint interface, the Cu atoms in the interfacial cathode Cu-Sn compound would experience the direct electromigration force and chemical potential force simultaneously, which have never been decoupled. In this work, a triple-junction Cu-Sn-Cu joint was designed and current-stressed to separate the above electromigration and chemical forces imposed on the Cu atoms in the Cu-Sn compound. In addition, by obtaining the individual value of the electromigration Cu flux in the cathode Cu6Sn5 compound layer, the effective charge number (Z*) of Cu atoms in the Cu6Sn5 compound can be determined to be 35.6. 其他題名： ECS Solid State Lett 出版者： The Electrochemical Society 出版日期： 2012-08-29 出處： ECS solid state letters, 2012-08, Vol.1 (5), p.P73-P75 版權： 2012 The Electrochemical Society 識別號： ISSN: 2162-8742 識別號： EISSN: 2162-8750 識別號： DOI: 10.1149/2.006205ssl
显示于类别:	[化學工程與材料工程學系 ] 期刊論文

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