摘要： •Interfacial reaction between SAC305 solders and Co (W,P)-based surface finishes.•Pd layer changed the morphology of the IMCs and increased the interfacial energy rsolder/substrate.•Massive spalling occurred in SAC/ECEP and SAC/ECEPIG during long time reflow.•The reduction of the stresses could be the driving force of the mass spalling. This study investigates the interfacial reactions and microstructures of SAC305 solders on four different Co-based surface finishes, electroless Co (EC), electroless Co/immersion Au (ECIG), electroless Co/electroless Pd (ECEP), and electroless Co/electroless Pd/immersion Au (ECEPIG). The evolution of microstructure at different reflow conditions revealed that Pd not only changed the morphology of the intermetallic compound but also generated higher interfacial energy between solders and Co-based substrates. High interfacial energy and thick reaction phase could induce compressive stress within the (Co,Cu,Pd)Sn3 layer during the reflow process after exhausting Co(W,P). The reduction of the stress could be the possible driving force of massive spalling of the (Co,Cu,Pd)Sn3 intermetallic compound. 出版者： Kidlington: Elsevier B.V 出版日期： 2013-12-15 出處： Journal of alloys and compounds, 2013-12, Vol.580, p.195-200 版權： 2013 Elsevier B.V. 版權： 2014 INIST-CNRS 識別號： ISSN: 0925-8388 識別號： EISSN: 1873-4669 識別號： DOI: 10.1016/j.jallcom.2013.05.109
