在這篇論文中，我們使用Poisson’s equation以及continuity equations設計出包含表面復合模型的二維混階元件模擬器。藉由這模擬器，可探討元件內部載子復合的情形，以及相伴隨的載子運動效應，接著我們將此種方法建立到一般的元件上，來探討表面復合效應對於元件的影響，並且為了證明電流的影響如同我們所假設，我們也另外建立一個電流極座標表示法，最後我們將討論的一個主題是以non-Bernoulli的電流表示方法，即回歸最原始的漂移電流以及擴散電流，並比較Bernoulli與non-Bernoulli的優缺點。 In this paper, we use Poisson’s equation and continuity equations to design the surface recombination model for 2-D device simulator. Because this simulator is designed to include the surface carrier recombination, we develop this surface recombination model for p-n diode and BJT device. For proving the influence of surface recombination current, we also build a vector plot to describe the current flow. Finally the other subject to be discussed is the non-Bernoulli equation for current expression. The non-Bernoulli equation returns to the most primitive expression for drift current and diffusion current. We will compare the Bernoulli method and non-Bernoulli method.
