隨著先進電子構裝技術與高密度互連結構的快速發展，可應用於高溫環境之無鉛接合材料的重要性日益提升。奈米銅粒子（Cu nanoparticles， Cu NPs）因具有優異的導電性、成本低廉及可於低溫燒結等優勢，被視為極具潛力之接合材料。然而，在低溫燒結條件下，若燒結緻密化不足，可能降低接點於高溫通電環境下之穩定性，並影響其電遷移（Electromigration， EM）可靠度。因此，本研究設計並製作一種奈米銅燒結接點試片，以評估其微結構、電性特徵及高溫通電行為。 將奈米銅膠塗佈於自製試片，於氮氣氣氛下以 300 °C 燒結 1 小時完成接合。結果顯示，當燒結壓力由 1 MPa 提高至 5 MPa，接點孔隙率下降、剪切強度提升，且估算之接點電阻率降低，證實加壓燒結能顯著改善接點之緻密性、機械強度與導電表現。電阻溫度係數（TCR）分析顯示，試片於實驗溫度範圍內之標準化電阻與溫度呈現優異線性關係。於不同高溫環境下進行通電測試，結果呈現不同程度的電阻變化紅外線熱像儀亦證實主通路溫升對未通電參考路徑之熱耦合效應。本研究完成奈米銅膠接點試片、高溫通電平台及電性量測流程之建構，所建立之方法可作為後續奈米銅接點高溫通電與電遷移可靠度研究之基礎。;With the rapid development of advanced electronic packaging technologies and high-density interconnect structures， lead-free bonding materials suitable for high-temperature environments have become increasingly crucial. Copper nanoparticles (Cu NPs) are regarded as highly promising bonding materials due to their excellent electrical conductivity， low cost， and low-temperature sintering capability. However， insufficient densification under low-temperature sintering conditions may degrade joint stability during high-temperature current stressing and subsequently impair electromigration (EM) reliability. Therefore， this study designed and fabricated a sintered Cu NP micro-joint specimen to systematically evaluate its microstructure， electrical characteristics， and high-temperature current-stressing behavior. In this study， Cu NP paste was applied to self-designed joint specimens and sintered at 300 °C for 1 h under a nitrogen atmosphere to form the joints. The results demonstrated that increasing the sintering pressure from 1 to 5 MPa effectively reduced joint porosity， enhanced shear strength， and lowered the estimated joint resistivity， confirming that pressure-assisted sintering significantly improves joint densification， mechanical strength， and electrical performance. Temperature coefficient of resistance (TCR) analysis indicated an excellent linear relationship between normalized resistance and temperature within the experimental range. Furthermore， continuous current-stressing tests conducted under various high-temperature environments revealed distinct profiles of resistance change， while infrared (IR) thermography confirmed a pronounced thermal coupling effect from the temperature rise of the active path to the unstressed reference path. Overall， this study successfully accomplished the implementation of the sintered Cu NP joint specimens， the high-temperature stressing platform， and the corresponding electrical measurement workflow. The established methodology can serve as a robust foundation for future investigations on the high-temperature current-stressing behavior and electromigration reliability of nano-Cu joints.
