隨著資訊獲取的方式越來越多元，其中獲取方式又以顯示科技最為大宗，當今顯示技術朝向高解析度、廣色域以及低功耗設計持續演進，而背光模組在整體顯示系統中所扮演的角色日益重要。作為顯示技術不可或缺的光源核心，背光模組的性能表現直接決定了整體面板的亮度均勻度、色彩品質與能源效率。其中，發光二極體（Light-Emitting Diode， LED） 背光模組結構的設計與演進，對於光學系統整合與功耗控制產生關鍵影響。 本研究以「低功耗發光二極體光機整合模組」為主題，探討不同 LED 結構對背光模組的實際影響。我們從傳統表面黏著式（Surface Mount Device， SMD）LED 與晶片級封裝(Chip on Board LED， COB) LED、新型晶片級封裝（Chip Scale Package， CSP）、倒裝封裝（Flip-Chip）在幾個關鍵面向上的差異：光輸出效率、發散角度分布、光耦合效率與散熱能力。並從三個方向進行分析討論 : 一、 發散角分布 —— 透過比較封裝結構差異與LED出光角度，確認其與導光板耦合效率及亮度的關聯。 二、 機構組配公差 —— 針對 LED 與導光板之間的間距進行優化，驗證結構設計對光能利用率的影響 三、 微透鏡形貌參數 —— 探討在封裝與模組製程中，模組點膠次數對色度偏移及亮度損耗的影響。 本研究中關於發散角的量化分析上，引入了朗伯模型作為LED發散角特性的理論基礎，而進一步分析指出，LED 的發散角度控制與晶片和封裝基板的相對位置對光學耦合效率有顯著影響。當背光模組結構能使光分布更集中於導光板的入光面時，不僅減少光能損耗，亦可降低系統對高驅動電流的依賴，達成低功耗化的設計目標。相對而言，傳統 SMD LED 及COB LED雖具有成熟製程與低成本優勢，但在厚度限制與高密度排列需求下，容易受到散熱瓶頸與光學效率下降的影響，限制其於超薄化、高亮度顯示器之應用。 綜合上述結果，本研究建立了一套 LED 結構與背光模組光學效能之間的關聯模型，並提出設計指引：透過採用 Flip-Chip CSP 新型封裝技術，可有效提升系統光能利用率並降低功耗，特別適合應用於攜帶式裝置。研究成果對於未來顯示產業在低功耗背光模組的光機整合設計，具有實際參考價值與應用潛力。;As the diversity of information access continues to expand， display technology has become the primary medium through which people obtain information. Modern display technology is advancing toward higher resolution， wider color gamuts， and lower power consumption， making the backlight module an increasingly critical component of the overall display system. As the essential light source in display technology， the performance of the backlight module directly determines the luminance uniformity， color quality， and energy efficiency of the panel. In particular， the structural design and evolution of LED backlight modules have a decisive impact on optical system integration and power consumption management.This study focuses on the theme of "low-power opto-mechanical integration modules，" investigating the practical effects of various LED structures on backlight module performance. We examine the key differences among conventional Surface Mount Device (SMD) LEDs， Chip on Board (COB) LEDs， Chip Scale Package (CSP) LEDs， and Flip-Chip LEDs across several critical aspects: luminous output efficiency， divergence angle distribution， optical coupling efficiency， and thermal dissipation capability. The analysis is conducted along three primary dimensions: 1. Light Distribution—How does the LED′s emission angle influence the coupling of light into the light guide plate and the resulting brightness of the panel? 2. Module Structure Tolerances—How Does the Gap Between the LED and the Light Guide Plate Affect Light Utilization? 3. Microlens Morphology Parameters: How Does the Number of Dispensing Steps in the Package Affect Brightness and Color Shift? In the quantitative analysis of divergence angle， this study employs the Lambertian radiation model as the theoretical basis for characterizing the angular emission profiles of LEDs. Further analysis demonstrates that controlling the LED divergence angle， along with the relative positioning of the chip concerning the package substrate， significantly influences optical coupling efficiency. When the backlight module structure facilitates a more concentrated light distribution toward the light-incident surface of the light guide plate， optical energy losses are minimized， and the system′s reliance on high drive currents is reduced， thereby achieving the design goal of low power consumption. In contrast， although conventional SMD and COB LEDs benefit from mature fabrication processes and lower manufacturing costs， they are prone to thermal bottlenecks and diminished optical efficiency under constraints such as reduced thickness and high-density array requirements， limiting their suitability for ultra-thin， high-luminance display systems. Based on the above findings， this study establishes a correlational model linking LED structural parameters to the optical performance of backlight modules and proposes corresponding design guidelines. The adoption of Flip-Chip CSP packaging technology is shown to effectively enhance system optical energy utilization and reduce power consumption， making it particularly suitable for portable device applications. The outcomes of this research provide practical reference value and application potential for the optical-mechanical integration design of low-power backlight modules in the future display industry.
