軟性印刷線路板（Flexible Printed Circuit Board， FPCB）產業作為電子製造業的關鍵組成部分，面臨全球市場需求變化與生產成本壓力的雙重挑戰，生產基地拓展已成為企業提升競爭力的重要策略。本研究以個案研究方法，針對軟性印刷線路板產業進行生產基地拓展議題進行深入探討，聚焦於空間產能對比與物流效率兩大核心面向，以期為相關企業的區位決策提供理論與實務參考。 在研究背景方面，隨著電子產品朝向輕薄短小、多功能整合方向發展，軟性印刷線路板的應用範圍持續擴大，涵蓋智慧型手機、可穿戴裝置、汽車電子及醫療器材等領域。本研究首先針對軟性印刷線路板產業的特性進行分析，包括產品輕薄短小、製程轉換頻繁、客製化程度高以及對運輸條件敏感等特質，這些特性使得生產基地的區位選擇必須同時考量產能配置與物流效率。 本研究的貢獻在於結合空間產能對比與物流分析，提供軟性印刷線路板產業生產基地拓展的系統性評估方法，對於面臨產能調整與區位重組壓力的業者具有實務參考價值。研究結論指出，未來軟性印刷線路板企業在進行生產基地拓展時，應建立動態的產能配置機制，並將物流效率納入區位決策的核心指標，以因應快速變化的市場需求與全球供應鏈重組趨勢。;As a key segment of the electronics manufacturing industry， the flexible printed circuit board (FPCB) industry is confronted with dual challenges from fluctuating global market demand and mounting production cost pressures. Expanding the layout of production bases has thus become a crucial strategy for enterprises to enhance their competitiveness. Adopting a case study methodology， this research conducts an in-depth investigation into the layout expansion of production bases in the FPCB industry， focusing on two core dimensions: spatial capacity comparison and logistics efficiency， with the aim of providing theoretical and practical references for location decisions of relevant enterprises. In terms of the research background， as electronic products evolve toward being lightweight， thin， compact， and highly integrated with multiple functions， the application scope of FPCBs has been continuously expanding， covering smartphones， wearable devices， automotive electronics， medical equipment， and other fields. This study first analyzes the characteristics of the FPCB industry， including the lightweight and miniaturized nature of products， frequent switching of production processes， a high degree of customization， and sensitivity to transportation conditions. These characteristics require that the site selection of production bases must balance capacity layout and logistics efficiency.
