本研究針對高體積分率之鋁碳化矽(SiC/Al)複材的製備需求，以聚碳矽烷(PCS)做為陶瓷預型體黏結劑，並以聚乙二醇(PEG)的添加來做為孔隙率大小的控制，透過低溫燒結的方式與溫度曲線的控制成功燒結兩不同孔隙率之碳化矽預型體。鋁基地方面，本研究透過對Al-7Si合金加入微量Sr元素來改質並比較了合金性質的差異，接著，再藉由真空壓力滲透法(VPI)，以1.3 MPa壓力的氣壓將改質前後之鋁合金滲進至孔隙率為55 %與40 %之碳化矽預型體中，最後，將滲透完成之鋁碳化矽複合材料進行熱性能、電性能以及相關力學行為測試，並依據測試結果以物相分析與微觀結構進行系統性地探討。 而其中發現，微量的鍶不僅能在SiCp/Al複材中，大幅改變其微小鋁連續相通道中的共晶矽生長模式，在與碳化矽顆粒的介面上也發現了與使用未改質鋁合金為基地的SiCp/Al複材截然不同的樣態，這種種跡象表明微量鍶在整體滲進製程中有參與一定程度的反應。 結論得出，在使用改質後的鋁合金的情況下成功以低壓的滲透方式進行熔體滲透，而其中，在比較低與高SiC體積分數SiCp/Al複材的性能表現中，比起使用未改質鋁合金為基地之SiCp/Al，其熱傳導率提升幅度分別高達29.8 %與29. 5%，抗彎強度提升幅度達13.6 %與19.7 %，在經退火熱處理後，提升幅度仍然還有9.2 %與10.4 %。在較高SiC體積分數之熱膨脹係數(CTE)為7.83 ppm/°C，而對於高熱傳導率以及低CTE的材料來說，已達應用於電子封裝的領域上之標準。;This study addresses the need for high volume fraction aluminum silicon carbide (SiC/Al) composites. Polystyrene carbosilane (PCS) was used as the binder for the ceramic preforms， and polyethylene glycol (PEG) was added to control porosity. Two silicon carbide preforms with different porosities were successfully sintered using low-temperature sintering and controlled temperature profiles. Regarding the aluminum matrix， this study modified the Al-7Si alloy by adding trace amounts of Sr and compared the differences in alloy properties. Then， using vacuum pressure infiltration (VPI)， the modified aluminum alloys were infiltrated into silicon carbide preforms with porosities of 55% and 40% at a pressure of 1.3 MPa. Finally， the infiltrated aluminum silicon carbide composites were tested for thermal properties， electrical properties， and related mechanical behavior. Based on the test results， a systematic investigation was conducted using phase analysis and microstructure analysis. It was discovered that trace amounts of Sr not only significantly altered the eutectic silicon growth mode in the micro-aluminum continuous phase channels of SiCp/Al composites， but also exhibited a completely different appearance at the interface with silicon carbide particles compared to SiCp/Al composites based on the matrix of unmodified aluminum alloys. These indications sugges that trace amounts of Sr participate in a certain degree of reaction in the overall infiltration process. The conclusion is that melt infiltration was successfully performed under low pressure using modified aluminum alloys. Among the comparisons of the performance of SiCp/Al composites with low and high SiC volume fractions， compared to SiCp/Al based on unmodified aluminum alloys， the thermal conductivity increased by 29.8 % and 29.5 % respectively， and the bending strength increased by 13.6 % and 19.7 %. Even after annealing， the improvements were still 9.2 % and 10.4 %. The coefficient of thermal expansion (CTE) for the higher SiC volume fraction was 7.83 ppm/°C， which meets the standards for applications in electronic packaging for materials with high thermal conductivity and low CTE.
