研究結果可知，透過FMEA與RPN風險評估方法的導入，拆裝機作業流程修正與製程氣體變更管理機制的建立，不僅能降低異常事件發生的頻率，也提高了施工品質與作業的穩定性與風險管控的能力。;In semiconductor manufacturing facilities， local scrubber frequently requires installation， removal， replacement， or relocation due to continuous process improvements and changing production requirements. Such operations require comprehensive planning and coordination to ensure operational safety and system reliability. However， abnormal events occurring during equipment installation and removal processes， including human mistake， mechanical causes， and process chemical gases modify from tool site， have often lacked systematic documentation， follow-up tracking， and improvement mechanisms. That is why， these incidents require extensive investigation， cross-departmental coordination， and corrective actions. This study investigates the hazards and abnormal events associated with the installation and removal processes of Local Scrubber systems in semiconductor facilities and proposes corresponding improvement measures.
This study collected and organized abnormal event records generated during previous installation and removal operations based on existing work procedures. Failure Mode and Effects Analysis (FMEA) and Risk Priority Number (RPN) methodologies were applied to evaluate the risks associated with these abnormal events. The analysis results indicated that the major causes of abnormal events could be categorized into three groups: human mistake， mechanical causes， and process chemical gases change from tool.
Based on the analysis results， the existing installation and removal procedures were reviewed and revised without affecting on-site construction quality and tool operation. In addition， a new process gas change management procedure was changed from tool and integrated into the operational workflow. The revised procedures were then implemented and validated in actual semiconductor facility operations. Prior to implementation， each installation or removal project experienced an average of 3 to 5 abnormal events. After implementation， the average number of abnormal events was reduced to 0 to 2 events per project， representing an improvement rate of approximately 60% to 100%. Furthermore， most of the remaining abnormal events were minor in nature and had minimal impact on project schedules and equipment operation. In some projects， no abnormal events were observed throughout the entire installation and removal process.
The implementation of the risk management mechanism and improved procedures not only enhanced personnel awareness of risk assessment and management practices related to installation and removal operations but also improved construction quality and operational stability. The results demonstrate that the application of FMEA and RPN methodologies， together with the optimization of installation and removal procedures and the establishment of a process gas change management system， can effectively reduce the occurrence of abnormal events while strengthening risk control capabilities. The proposed risk assessment and continuous improvement framework can serve as a practical reference for future installation and removal operations of exhaust gas treatment equipment in semiconductor manufacturing facilities， thereby enhancing operational safety， equipment reliability， and overall risk management performance.
