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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/13531


    Title: 從虛擬企業整合觀點探討企業競爭力-以A半導體封裝測試業為例
    Authors: 游輝榮;Hui-Jung Yu
    Contributors: 管理學院高階主管企管碩士班
    Keywords: 企業流程整合;顧客關係;需求鍊管理;虛擬工廠;虛擬企業整合;Virtual Factory;Virtual Enterprise Integration;Demand Chain Management;Business Process Integration;Customer Relationship
    Date: 2003-05-23
    Issue Date: 2009-09-22 15:34:14 (UTC+8)
    Publisher: 國立中央大學圖書館
    Abstract: 隨著電子商務時代的來臨,供應鍊與全球運籌管理的興起,臺灣半導體產業已充分感受到新資訊科技時代的衝擊。以代工為主的臺灣半導體製造業如何有效地建置為產業鍊中的虛擬製造(Virtual Manufacturing)工廠,成為業者經營與市場競爭的重要課題。 本研究以文獻探討與個案研究方式,探討企業應如何進行虛擬企業整合,強化顧客關係與其市場競爭力。首先從顧客的需求鍊構面,探討個案A公司在進行虛擬企業整合過程中,遭遇種種的客訴事件;與從顧客對其供應商(A個案公司)的評比項目中,整合分析得知虛擬企業整合進行的迫切性,與顧客如何選定其供應鍊伙伴的要素。其次則探討A公司與其顧客建立電子資料交換(EDI),顧客專屬網頁,B2B等活動。綜合本研究得知,促成虛擬企業整合實施成功的要素為: 高階主管支持 學習型的組織文化 因應環境變化,不斷地進行企業流程研究、改進與整合 企業資訊科技應用的成熟程度,如MES、ERP的導入與應用程度 交易伙伴間的需求與其合作程度 最後本研究探討企業可如何應用相關管理方法,如ISO/TS16949 品質系統實施、知識管理方法、平衡計分卡、RosettaNet B2B標準架構等實施經驗,結合虛擬企業整合建構,達到相輔相成的效果。 本研究的結論可以歸納如下: 1. 品質、成本和技術仍是半導體封裝測試業的重要競爭要素;虛擬企業整合能力,已成為半導體代工業強化顧客關係的利器。 2. 高階主管的認同、參予與決心,是虛擬企業整合得以順利推展的最主要關鍵。 3. 企業內部流程研究、改進、整合與企業資源規劃,是虛擬企業整合成功的重要途徑。 4. 企業內、外部流程整合應當同時考慮物流,金流,資訊流,組織、知識、文化流。 5. ISO/TS16949、平衡計分卡、知識管理、RosettaNet PIPs等管理工具與實施經驗,可與虛擬企業整合實施相輔相成。 6. EDI、B2B、顧客專屬網頁精確的資訊品質,可以減少顧客抱怨發生,強化企業形象與顧客關係。 7. 因應外在環境變化與新需求不斷產生,持續的企業內外部流程改善和系統整合,必須永遠伴隨企業成長。 In the age of Electronic Commerce (EC),supply chain and global logistic management become more important, the semiconductor companies in Taiwan already understand the trend of the the impact from the new information technology. The semiconductor manufacturers in Taiwan should build up their company as a Virtual Factory (VF) effectively in the semiconductor industrial chain. It is a critical step to enhance their competitiveness and to build up better customer relationships. This study attempts to explore how a company enhance customer relationships by Virtual Enterprise Integration, using a case study of a semiconductor subcontractor. Firstly from the customer complaint cases in “A” subcontractor, to summarize the root causes of complaints. Because EDI, Customer Web and B2B projects don’t implement properly. Further analysis of supplier ranking items of subcontractor shows virtual enterprise integration is a key factor while IDM, IC design houses and Foundries select their partner. The results of this study demonstrate that quality system - ISO/TS16949, knowledge management, Balanced Score Card and RosettaNet B2B Standards can implement with virtual enterprise integration in parallel to complement one another. The conclusions of this study are: 1. Quality, cost and technology are still the key competitive factors for semiconductor subcontractors, however, the capability of virtual enterprise integration has been becoming an powerful tool to enhance customer relationship. 2. The support, involvement and determination from top management team are the key factors to make a VEI project successful. 3. Business process research, improvement, integration and enterprise resource planning are the important foundations for implementing VEI. 4. The internal and external business process integration should consider material flow, cost flow, information flow and the knowledge, culture flow in an organization. 5. ISO/TS16949 quality system, Balanced Score Card, knowledge management and RosettaNet PIPs standards etc., management methodology and implementation experience can go with Virtual Enterprise Integration in parallel to complement one another. 6. The accurate quality of information and data through EDI, B2B, Customer Web can reduce customer complaints, enhance enterprise reputation and build up better customer relationships. 7. Business improvement and integration should be performed continuously to meet business environment changes.
    Appears in Collections:[Executive MBA] Electronic Thesis & Dissertation

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