本研究主要使用CO2 雷射與運用控制破裂切割原理在陶瓷基板 切割。並使用所建立的雷射切割平台，來驗證破裂控制切割原理與 實際應用在LED 低溫共燒陶瓷基板上。 Localized heating by CO2 laser followed by water quenching was applied to control fracture growth for cutting ceramic substrate. The process was successfully demonstrated on breaking LED LTCC ceramic substrate with a laser cutting platform
