| 摘要: | 環氧樹脂廣泛應用於層壓板、半導體封裝、塗料等行業，隨著這些行業對環氧樹脂可靠性、安全性的要求日益增高，對環氧樹脂阻燃性能的要求也逐漸提高，採用含有鹵素阻燃劑的板材，雖對抑燃具有相當的效果，但會產生具有腐蝕性和毒性的鹵化氫氣體，且發煙量大，燃燒時有產生戴奧辛的疑慮，已有國家將其列入管制。而有機磷系阻燃劑阻燃效率高，受熱或燃燒時腐蝕性有毒氣體生成量低，但最終產品存在著阻燃性能持久性差，以及產生增塑作用，玻璃轉化溫度(Tg)降低；另外PCB產業中，一般為了降低熱膨脹率、提高熱傳導率及耐熱性等用途，常以添加奈米級的填充劑為解決手段。 本論文利用以田口法設計實驗，含磷環氧樹脂為主成分，添加無機填充材氫氧化鋁、硬化劑和速化劑製成膠片，並利用TGA、DSC、平板式流變儀等儀器來研究各樣品之化學流變特性，評估氫氧化鋁是否適用於含磷環氧樹脂系統中，並利用實驗結果對壓合參數之設定提出建議。 Epoxy has been used in Laminar, IC carrier and paints, the halogens resin material was used to content the higher request of the thermal resistance, although it represented well to the flame-retardant effect, but it will bring the caustic and poisonous gas and a lot of smoke and dioxin when it was burned, there were many countries taking it into control. The flame-retardant efficient of the organic phosphorus fire retardant is good, and produces fewer caustic gas, but the performance of the flame-retardant effect is bad, the plasticization is resulted and Tg is reduced；In the industry of PCB, the nanometer filler was used to reduce the effect of the thermal expansion, increase the efficient of thermal conduction and the thermal resistance, In this article, the experiment is designed by using the Taguchi method, and the prepreg was made by using the epoxy with DOPO, the filler of Al(OH)3,Dicy and 2-MI, analyzed the Chemorheology by using TGA, DSC,plate to plate rheometer, to estimate that is Al(OH)3 suited the epoxy with DOPO, and try to make suggestions to the parameter of lamination. |
