| 摘要: | 本研究的目的在於建立陽極導引微電鍍系統所需之電鍍電壓/電流監測方式、電鍍電源控制方法及陽極移動機構位移方式，並嘗試找出使微電鍍析鍍物直徑與陽極相近、結構緻密的最佳電鍍參數及流程控制方法。使用間歇電鍍的方式，可析鍍高深寬比的結構，但陰陽兩極的間距在間歇電鍍過程中持續變小，電場分佈差異大，因此期望透過微電鍍系統，找出與兩極間距相關參數，使電鍍過程電場分佈差異性減少，以獲得組織均勻的析鍍物。本文探討自製微電鍍系統之機構、電控架構及其優缺點，包含二極式微電鍍系統、四極式微電鍍系統、多陽極式微電鍍系統及恆電位/恆電流微電鍍系統，並由實驗及析鍍物之外觀，嘗試找出各項影響微電鍍析鍍之參數及其影響程度。 由實驗結果發現，電鍍電壓愈大或間歇電鍍每次上升距離愈小，析鍍速率愈快，但析鍍物的結構也變得愈差，此外，陽極與析鍍物之間距，因電雙層電容效應，不太容易由量測的電壓或電流值計算獲得。 The purpose of the research is building the voltage and current measuring system, electrodeposition power source control system and the anode moving mechanism for the micro-anode guided electroplating, also name as MAGE. We tried to find the electroplating parameters and the proper control procedures to refine the material structure of the deposition and let its diameter to be near to the diameter of the anode. By intermittent MAGE, we can easily obtain high aspect ratio deposits, but the distance between the anode and the deposit is getting small, and the electric field strength also become higher, continuously. The target is the find the electroplating parameters that highly correlate with the distance between the anode and the deposit, and by controlling those parameters to have an uniform distribution of the electric field during electroplating and to make the deposition have a fine material structure. In this article, we disclosed the development of the MAGE control system in the last decade, including, Two-Electrode MAGE control system, Four-Electrode MAGE control system, Multi-Anode MAGE control system and Potentiostat/Galvanostat MAGE control system, and by experiments and the deposits, trying to find the parameters that affect the deposits and their influences. We found if the applied voltage is higher or the intermittent MAGE gape between electrodes is smaller, the deposition rate will be higher, but the material structure will also worse, and due to the double layer effect, the distance between the anode and the deposit is hardly obtained by only measuring the voltage and the current of the electroplating. |
