摘要 本篇論文主要是針對鋁電解電容器(aluminum electrolytic capacitor)用低壓陽極箔進行研究。經不同製程參數下之鋁箔，藉由電化學蝕刻之微結構的調查。 實驗首先利用ICP-AES來分析低壓陽極箔內所含之微量元素，確定其元素及含量，以便後續之研究。探討不同製程參數，分別對不同均質化、冷加工量、熱滾軋及安定化處理(stablizing treatment)，在不同製程下之電蝕箔進行研究。透過極圖分析(pole figure)及穿透式電子顯微鏡(TEM)，了解微鋁箔的集合組織和微組織結構。 在電化學蝕刻之後，再按照EIAJ的規範對電蝕箔做化成處理，並量測其靜電容量及重量損失率。利用光學顯微鏡(OM)及掃描式電子顯微鏡(SEM)，來觀察電蝕箔之截面腐蝕形態及表面的腐蝕孔洞分佈情形。藉由這些分析方法，來比較不同製程參數所造成之腐蝕組織，對鋁電解電容器用低壓陽極箔之靜電容量的影響。 由實驗得知:在實施不同冷加工量的鋁箔，靜電容量差異不大，其中以90%最佳；而均質化和熱滾軋溫度的提升，可使孔洞分布均勻，減少粗大的孔洞產生，進而增加靜電容量；在安定化處理方面，適當的安定化可使集中的差排消解，得到較佳的差排分佈，經安定化處理其靜電容量都比未安定化處理提昇許多。 Abstract The experiment is aimed at the study of the anode foil of aluminum electrolytic capacitor. In this paper, the electrochemical behavior of high purity aluminum foils with the different parameter of the thermal treatment has been studied. First of all, the chemical compositions of high purity aluminum foils were determined before etching by using the analysis of ICP-AES. This research will examine different parameter of procedure such as different homogenization treatment, cold rolling, hot rolling, and stabilizing treatment. The texture of Al-foil was analyzed by pole figure, and microstructure observation was used by transmission electron microscope (TEM) . After electrochemical etching, we forming according to EIAJ standard and measure its capacitance and rate of weight loss. To discuss the effect of capacitance caused by etched structure, the morphology of etched surface and cross section was observed by scanning electron microscope (SEM) and optical microscope (OM).From the observation of etched microstructure , the effect of procedure factors on the etching behavior of high purity aluminum foils could be studied in details. In the results of experiment, it was found that the capacitance is similar under different cold-rolled. When the temperature of homogenization treatment and hot-rolled was raised, the capacitance will be increase. And then it had fine pit which distributed uniform .The fitting of stabilizing treatment could scatter dislocation. And the sample of stabilizing treatment was carry out , it had better capacitance than not stabilizing treatment.
