Sn-3Ag-(0~0.9)Cu銲料迴銲於銅基板後之電化學遷移行為

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題名:	Sn-3Ag-(0~0.9)Cu銲料迴銲於銅基板後之電化學遷移行為
作者:	蘇茂華;Mau-Hwa Su
貢獻者:	機械工程研究所
關鍵詞:	錫銀銅銲料;循環;無鉛銲料;陽極動態極化;電化學遷移;electrochemical migration;lead-free solders;SnAgCu solder
日期:	2004-07-12
上傳時間:	2009-09-21 11:45:28 (UTC+8)
出版者:	國立中央大學圖書館
摘要:	摘要本研究探討錫-3 銀-X 銅(X=0.0~0.9)銲料迴銲於銅墊上之電化學遷移行為，將其完全浸泡於不同溶液中，兩銲球間施以2V~3V 直流偏壓，結果顯示：在去離子水中與硫酸氨溶液中，增加銲料中銅含量與提高施加偏壓，皆會造成銲料抗電化學遷移能力下降；在松香型助銲劑、酒精及異丙醇中不發生電化學遷移現象。在去離子水中的陽極動態極化研究結果顯示：本系統銲料之開路電位隨著銅含量增加而升高，在1.5VSCE 以上，其陽極電流隨銲料中的銅含量增加而提高。X 光光電子譜儀分析顯示：迴銲後銲錫表面有一層SnO2 覆蓋，若銲料中銅含量越高，兩極間析出物中銅的比例隨之提高；此析出物中銅與銀的含量比例隨遷移時間增長而減少。錫-3 銀-X 銅(X=0.0~0.9)銲錫在(NH4)2SO4溶液中之電化學遷移比在去離子水中更嚴重。循環極化分析的第一圈掃描未見Sn-3Ag-0.9Cu 銲錫的鈍化現象，然而在第二圈以上發現銲錫的鈍化現象，且越低的掃描速率，銲料的鈍化情況越明顯。 Abstract Electrochemical migration behaviors of the Sn-3Ag-XCu(X=0.0~0.9) solders reflowed on Cu pads have been studied. The electrochemical migration resistance of the Sn-3Ag-XCu(X=0.0~0.9) solders at a bias of 2V~3V in DI water or (NH4)2SO4 decreased with increasing Cu content from 0.0 to 0.9 wt% and electrical bias from 2 to 3 V. Sn-3Ag-XCu(X=0.0~0.9) solders displayed no electrochemical migration in rosin mildly activated flux, ethanol or isopropyl alcohol solutions. The anodic potentiodynamic polarization in DI water showed that OCP of Sn-3Ag-XCu(X=0.0~0.9) increased with increasing Cu content. The anodic current of solders increased with increasing Cu content at the same potential above 1.5VSCE. XPS spectra showed that SnO2 oxide covered on the solder balls after reflow. The copper content in the precipitate increased with Cu content in the Sn-3Ag-XCu(X=0.0~0.9) solders. The ratio of Ag and Cu content in precipitate decreased with migration time. The electrochemical migration of Sn-3Ag-XCu(X=0.0~0.9) is faster in 0.01M (NH4)2SO4 than in DI water. Passivation was absent on the first cycle of the cyclic voltammorgrace, however, it was present on the cycle higher than the second. The lower scanning rate, the more pronounced is the passivation.
顯示於類別:	[機械工程研究所] 博碩士論文

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