本論文中，進行三種不同固晶封裝方式，分別對不同製程下之晶片接合表現進行分析，並且利用實驗，發展出具有穩定性與一致性之金錫合金製程技術，配合X-ray分析與推力測試，對於三種不同固晶接合方式，進行機械強度之評比。 接著，提昇熱阻系統量測之穩定性與準確度，並對於不同固晶方式之LED進行熱阻量測分析，區分三種固晶方式之熱阻值優劣，最後，以熱循環測試LED，藉此進行不同固晶方式下，產品之可靠度分析，文末，以上述方式，驗證並討論出對於高功率白光LED最優異之封裝固晶技術。 In this thesis, we study three different kinds of die bonding process and analyze their bonding strength. By experimentation, we develop a eutectic bonding process which is not only stable but also identical. Besides, we implement the LED assembly analysis by x-ray inspection and die shearing test. Furthermore, we enhance the stabilization and accuracy of the thermal resistance measurement system, also, measure the thermal resistance of these three die bonding process and rank them. Finally, we tested LED reliability by thermal cycle. Through the comparison between the foregoing methods, we get the best die bonding technique for high power white-light LED.
