On the resistance of silver migration in Ag-Pd conductive thick films under humid environment and applied dc field

NCU Institutional Repository > 工學院 > 機械工程研究所 > 期刊論文 > Item 987654321/27048

jsp.display-item.identifier=請使用永久網址來引用或連結此文件: http://ir.lib.ncu.edu.tw/handle/987654321/27048

题名:	On the resistance of silver migration in Ag-Pd conductive thick films under humid environment and applied dc field
作者:	Lin,JC;Chan,JY
贡献者:	機械工程學系
关键词:	PALLADIUM;ALLOY;SPECTROSCOPY;TECHNOLOGY;OXIDES;ESCA
日期:	1996
上传时间:	2010-06-29 18:06:25 (UTC+8)
出版者:	中央大學
摘要:	Silver migration occurring in pure silver conductive thick films was minimized by using Ag-Pd alloys. The in situ microscopic observation, under humid environment and an applied d.c. field, showed that the out-growth of silver dendrites from the cathode decreases with increasing (5-20%) amount of Pd in the Ag-Pd specimens, and ceases completely at 30% Pd. The enhancement of silver migration resistance with increasing Pd concentration in Ag-Pd conductors was evident by the measurements of the short circuit current between a couple of thick-him electrodes in distilled water at 5 V. Through the study of anodic potentiodynamic polarization in 0.01 M NaOH and the examination of the surface films on the thick films by X-ray diffraction and surface analyses (Auger and ESCA), it was found that the anodic formation of PdO blocks the silver dissolution, and minimizes the occurrence of silver migration.
關聯:	MATERIALS CHEMISTRY AND PHYSICS
显示于类别:	[機械工程研究所] 期刊論文

文件中的档案:

档案	描述	大小	格式	浏览次数
index.html		0Kb	HTML	410	检视/开启

在NCUIR中所有的数据项都受到原著作权保护.

社群 sharing