An atmospheric-pressure plasma process for C2F6 removal

NCUIR > Engineering College > Graduate Institute of Environmental Engineering > journal & Dissertation > Item 987654321/30174

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30174

Title:	An atmospheric-pressure plasma process for C2F6 removal
Authors:	Chang,MB;Yu,SJ
Contributors:	環境工程研究所
Keywords:	ABATEMENT;EMISSIONS;CF4
Date:	2001
Issue Date:	2010-07-06 16:13:48 (UTC+8)
Publisher:	中央大學
Abstract:	Perfluorocompounds (PFCs) are widely used in the semiconductor industry for plasma etching and chemical vapor deposition (CVD). They are relatively inert gases that intensely absorb infrared radiation and, therefore, aggravate the greenhouse effect. A ben
Relation:	ENVIRONMENTAL SCIENCE & TECHNOLOGY
Appears in Collections:	[Graduate Institute of Environmental Engineering ] journal & Dissertation

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