The aim of this study is to investigate the creep rupture behavior of lead-free Sn-3.5Ag and Sn-3.5Ag-0.5Cu solders at three temperatures ranging from room temperature (RT) to 90 degrees C, under a tensile stress range of sigma/E = 10(-4) to 10(-3). The u
關聯:
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
