Optimizing the wire-bonding parameters for second bonds in ball grid array packages

NCUIR > Engineering College > National Central University Department of Chemical & Materials Engineering > journal & Dissertation > Item 987654321/31021

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/31021

Title:	Optimizing the wire-bonding parameters for second bonds in ball grid array packages
Authors:	Ho,CE;Chen,C;Kao,CR
Contributors:	化學工程與材料工程研究所
Date:	2000
Issue Date:	2010-07-06 16:33:08 (UTC+8)
Publisher:	中央大學
Abstract:	The bonding parameters for the second bonds in EGA were optimized using the Taguchi L27 experimental design. The bond wire was a 33 mu m gold wire, and the bond pads had Au/Ni/Cu three-layer structures. The objective function for the optimization was the
Relation:	JOURNAL OF THE CHINESE INSTITUTE OF ENGINEERS
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

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