將熱固性高分子(酚醛樹脂)與鱗片石墨粉以熱壓成型的方式製備高分子複合材料雙極板，藉由拉伸測試、彎曲測試、電阻測試，探討於180℃、200℃、220℃、240℃、260℃等壓模溫度以及添加15wt%、20wt%、25wt%、30wt%等不同酚醛樹脂比例，對於石墨複合板的拉伸強度、彎曲強度及導電率的影響，除此也將兩種不同顆粒大小的鱗片石墨，以相同重量百分比混合，於180℃、200℃、220℃、240℃、260℃等壓模溫度以及添加15wt%、20wt%、25wt%、30wt%等不同酚醛樹脂比例，比較與使用單一顆粒石墨所壓製出的石墨複合板的差異，實驗結果以100mesh鱗片石墨添加30wt%酚醛樹脂於180℃時所壓製出的石墨複合板，拉伸強度22.96(MPa)為最佳，以100mesh添加80mesh混合30wt%酚醛樹脂於200℃所壓製出的石墨複合板其彎曲強度41.78(MPa)為最佳，穿透導電率方面以50mesh鱗片石墨添加15wt%酚醛樹脂於180℃時所壓製出的石墨複合板110.5(S/cm)為最佳，表面導電率以80mesh鱗片石墨添加15wt%酚醛樹脂於240℃時所壓製出的石墨複合板323.66(S/cm) 為最佳。 With thermosetting polymer (phenol formaldehyde resin) and flake graphite as raw materials, a kind of composite bipolar plate is obtained by hot-pressure molding. The effects of holding temperature(180℃、200℃、220℃、220℃、240℃、260℃) and phenol formaldehyde resin content(15wt%、20wt%、25wt%、30wt%)on the Tensile strength 、Flexural strength、Conductivity of composite bipolar plate were discussed. To compare two kinds of the different size flake graphite were mixed with the same percentage by weight with single particle size of the flake graphite at different holding temperature(180℃、200℃、220℃、220℃、240℃、260℃) and different phenol formaldehyde resin content(15wt%、20wt%、25wt%、30wt%). The results show that : add 100mesh flake Graphite with 30wt% phenol formaldehyde resin of the graphite composite plate at 180℃, the tensile strength of 22.96 (MPa) for the best. 100mesh mixed 80mesh with 30wt% phenol formaldehyde resin of the graphite composite plate at 200℃, flexural strength of 41.78 (MPa) for the best. 50mesh flake Graphite with 15wt% phenol formaldehyde resin of the graphite composite plate at 180℃, Through-Plane Conductivity of 110.5(S/cm) for the best. 80mesh flake Graphite with 15wt% phenol formaldehyde resin of the graphite composite plate at 240℃, In-Plane Conductivity of 323.66(S/cm) for the best.
