近年來由於微機電系統（Micro-Electro Mechanical System, MEMS）之蓬勃發展，MEMS之相關製程、應用逐漸受到矚目。其中超音波振動加工常被用於硬脆材料的加工，如玻璃、石英等。其加工原理是在刀具及材料間的磨粒受到超音波高頻率的振動驅使而撞擊材料，使材料產生微破裂進而去除材料的加工方式，由於製程簡單因此廣泛的應用於工業界。 本篇研究以超音波振動加工對石英微孔進行加工特性探討，並以結合電泳沈積法及超音波振動之複合拋光製程對加工後的微孔孔壁進行精微拋光的研究。由實驗結果得知，以磨料濃度30%、步進精度0.1µm、進給速度25µm/min、振幅5.4µm、轉速1000rpm之加工參數下，可成功的得到形狀完整之石英微孔。再以電壓5V、磨料濃度10%、電泳液pH 9，經1分鐘的電泳沉積後，可將SiC磨粒有效的沉積於碳化鎢刀具表面，並由超音波振幅6.3µm、刀具轉速2500rpm、研磨時間30min、磨料粒徑0.25µm的拋光下，可將超音波振動加工後之微孔表面粗糙度由Rmax0.48µm改善為Rmax0.08µm，其表面粗糙度改善率為83.3%。 The micro ultrasonic vibration machining（MUSM）is a non-traditional method that able to machining the hardness and brittleness material like quartz. The basic structure of micro-fabrication is the micro-holes which can use to various applications. However, the vibration of high frequency during MUSM process causes the abrasive particles impact the workpiece by micro-chipping and filled with micro-craters in micro-holes. Hence, this study attempts to improve the quality of MUSMed micro-holes by a polishing method that combines electrophoretic deposition（EDP）and ultrasonic machining（USM）. According to the result, the micro ultrasonic vibration machining can be fabricate with suitable parameters in MUSM, such as slurry concentration of 30 Wt%, step accuracy of 0.1µm, federate of 25µm/min, amplitude of 5.4µm and rotational speed of 1000rpm which can obtain accuracy micro-holes. After fabricate of micro-holes has done by MUSM process, the polishing parameters such as amplitude of 6.3µm, polishing time of 30min, rotation speed of 2500rpm and SiC particle size of 0.25µm can successfully finish the micro-holes which reduced the surface roughness from Rmax0.48µm to Rmax0.08µm.
