工業發展導致溫室效應氣體大量排放，地球平均溫度因此持續升高，近年來因氣候型態改變所造成的影響更日益嚴重，有關溫室氣體減量的議題逐漸受到重視，1997年12月於日本京都召開的溫室效應氣體管制會議中，決議將包括CO2、CH4、HFCs、N2O、 PFCs （Perfluorinated compounds, 全氟化物）及SF6等氣體列為管制項目，2005年2月16日京都議定書正式生效，國際間對溫室效應氣體減量具備法律效力。 薄膜電晶體液晶顯示器 （Thin-Film Transistor Liquid Crystal Display, TFT-LCD）製造業為國內繼半導體產業後政府大力扶植的重要產業之一。我國雖非京都議定書中附件一的規範國家，但身為地球村的一份子本來就應共同努力維護賴以為生的自然環境，本研究依循國際標準組織ISO 14064溫室效應氣體盤查程序執行，藉以獲得正確的排放基線資料，並瞭解公司內部之減量空間所在，以降低溫室效應氣體排放強度。 研究結果顯示TFT-LCD的生產過程中其溫室效應氣體的主要排放源為用電所產生，佔60%以上，主要用電比率以壓縮乾燥空氣所佔的比率最高，約佔18%，Array製程設備用電比率達17.4%，廠務系統的冰水主機 (Chiller) 則佔了11%，而溫室效應氣體排放量居次者為乾蝕刻 (Dry Etching) 製程的SF6，再者為化學氣相沉積 (CVD, Chemical Vapor Deposition) 製程的NF3，而每生產單位面積面板其排放強度為0.1050 MTCE/m2，以燃燒式去除設備對SF6及NF3其去除率均可達90%以上，符合台灣薄膜電晶體液晶顯示器產業協會（Taiwan Thin Film Transistor Liquid Crystal Display Association , TTLA）所承諾的0.0335 MTCE/m2目標值，其燃料在燃燒過程所產生的二氧化碳量僅約為削減量的0.4%。 Industrial development makes the bloom of economy and discharge tremendous amount of global warming gases into the atmosphere, leading to the increase of the earth temperature. In recent years the climate change has caused a lot of natural disasters and the situation is getting worse. Hence, emission of global warming gases has received more and more attention. The Conference held in Kyoto in December 1997 made the conclusion to identify CO2、CH4、HFCs、N2O、PFCs and SF6 as the items which have to be regulated. On 16th February 2005, the Kyodo protocol became effective. The TFT-LCD is an important industry which our government intends to develop after the semiconductor industry. Although Taiwan is not one of the countries regulated by the Kyoto protocol, we still have to protect our environment. This research follows the ISO 14064 to evaluate the greenhouse gas emissions. Once the sources and the emission strength are identified and determined, the baselines of GHG emissions from TFT-LCD industry are constructed. This study indicates the biggest amount of the greenhouse gases of this site is emitted by power usage as 60%. The second one is dry etching process gas SF6. The third one is CVD process gas NF3. The biggest amount of power is consumed by providing compressor air as 18%. The second one is array process equipment as 17.4%. The third one is chiller unit as 11%. The CO2 equivalent emitted is measured as 0.105 MTCE/m2. To present the burning type process is the most effective technology to treat SF6 and NF3. So far it can reduce 90% SF6 and NF3 and only increases 0.4% CO2 emission. This study indicates PFC emissions could be reduced to meet the goal 0.0335 MTCE/m2 set by TTLA for 2010 if proper measures are taken.
