大尺寸LED晶粒固晶之研究; Study of Die Bonding for Large-Size LED Die

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/43837

Title:	大尺寸LED晶粒固晶之研究;Study of Die Bonding for Large-Size LED Die
Authors:	張建宏;Jain-hong Zhang
Contributors:	光電科學研究所
Keywords:	超音波檢測;熱阻;推力測試.;固晶技術;超大尺寸LED晶粒;金錫共晶合金;Die Shear Strength;Scanning Acoustic Microscope.;Thermal Resistance;Eutectic Gold/Tin Alloy;Die Bond;Extra-Large-Size LED Die
Date:	2010-07-31
Issue Date:	2010-12-08 14:22:32 (UTC+8)
Publisher:	國立中央大學
Abstract:	在本研究中，我們發展超大尺寸晶粒固晶製程技術，以金錫共晶合金固晶製程為主要研究方向，發展其製程配方、特性量測與性能評估。製程配方的參數包含了最高的製程溫度、最高溫度的持續時間、溫度斜率、下壓力、氮氣施加方式與助焊劑。特性量測選用掃描式超音波顯微鏡檢測黏著狀態、穩態紅外線熱阻量測法檢測熱阻以及使用推拉力機量測黏著強度，再藉由這些特性量測做性能分析。固晶黏著材料除了金錫共晶合金以外，還有一般銀膠、高導熱銀膠、錫膏和預成型錫片，因此我們針對同一的基板與晶粒做不同黏著材料的固晶製程，並對這些不同固晶方式進行比較。 In this thesis, we study the processing technology of eutectic Gold/Tin alloy for an extra-large-size LED die. We develop the recipe of eutectic process and analyze the characteristic of measuring results. The corresponding parameters include highest temperature, temperature profile, bonding force, nitrogen condition and flux for eutectic process. In the measurement procedures of die bonding process, we apply infrared system to measure the thermal resistance and use bonding tester to estimate the die shear strength. Bonding state between die and substrate is inspected by scanning acoustic microscope. Finally, we compare the characteristic of experimental results, including silver paste, high thermal conductivity silver epoxy adhesive, solder paste, solder perform, among difference die bonding processes.
Appears in Collections:	[Graduate Institute of Optics and Photonics] Electronic Thesis & Dissertation

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