近幾年在高功率LED快速發展之下，LED工作時所產生龐大熱量對晶片的影響，已是當前急需解決的重大問題之一。如何評估LED封裝結構與模組系統的散熱能力，進而解決其熱累積的問題，發展一套可靠的熱阻量測系統是絕對必要的課題。目前已有數種不同的熱阻量測系統被提出，但尚未有一套可被完全接受的方法。本論文建構一套LED封裝暫態熱傳量測系統，並利用此系統來量測(1)不同的散熱膏厚度與(2)改變散熱銅基板幾何形狀對於LED晶片接面溫度對時間的響應，進而分析與探討LED封裝結構中熱傳導的行為。 The thermal management of high-power LEDs is a very important issue. A measurement system is designed to measure the transient behavior of the junction temperature of LEDs with a continuous direct current input. The thermal transient measurement system can be used to investigate the characteristics of the thermal transfer in LED package. In this work, we investigated the effect of the dimensions size of Cu substrates and the thickness of the thermal paste on the heat dissipation.
