具聚合物波導光路之矽光學平台發展晶片內部光學連接技術;Intra-Chip Optical Interconnects Based on Silicon Optical Bench with Polymer Waveguides

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题名:	具聚合物波導光路之矽光學平台發展晶片內部光學連接技術;Intra-Chip Optical Interconnects Based on Silicon Optical Bench with Polymer Waveguides
作者:	伍茂仁
贡献者:	光電科學與工程學系
关键词:	研究領域：光電工程
日期:	2011-08-01
上传时间:	2012-01-17 18:58:15 (UTC+8)
出版者:	行政院國家科學委員會
摘要:	本研究計畫的主要目的，是發展具聚合物波導光路之矽光學平台發展晶片內部光學連接技術，經由光學模擬分析與實體製程開發，將極具潛力的聚合物波導光路之矽光學平台引入晶片間或晶片內部光學連結之實際應用。聚合物波導光路已經被運用於晶片對晶片之光學連結，然而該技術瓶頸在於整合主動元件與聚合物波導光路。針對上述問題，本計畫將在具45°反射面之矽光學平台整合聚合物波導，發展90°光路轉折的積體化平面光路，提出全新之導波矽光學平台(guided-wave silicon optical bench, GW-SiOB)。並在GW-SiOB 上開發傳輸速度達10 GHz 及25 GHZ 之高頻傳輸線，並整合850 nm 面射型雷射(vertical cavity surface emitting laser, VCSEL)及砷化鎵光檢測器(photo-detector, PD)等晶片．本三年型之研究計畫內容將包含有：第一年: 導波矽光學平台: 具45反射面之SiOB 與聚合物波導單石積體化結構設計與製程開發第二年: 1 channel × 25 Gbps 晶片內部光學連接模組開發第三年: 4 channel × 10 Gbps 晶片內部光學連接模組開發此外，光學連接模組所需之光學設計技術、光學連接模組所需之高頻訊號設計技術、微機電半導體製程技術和精密構裝技術等也將會被探討。藉由本計畫所提之聚合物波導光路之矽光學平台發展晶片內部光學連接技術將可以實現於矽基板上，除了可以單石積體化波導光路外，還可以整合VCSEL、PD 和電子IC 元件等．因此可以期待一兼具高速光連結與多工之SOC 晶片的實體化應用實現。 This research focuses on developing the intra-chip optical interconnects based on silicon optical bench with polymer waveguides. Based on the optical simulated analysis and fabrication process development, the recently potential silicon optical bench with polymer waveguides would be introduced into inter-chip or intra-chip optical interconnect applications. The polymer waveguides have been already applied into chip-to-chip optical interconnects; however, the bottleneck of this technique is the integrated between various active components and polymer waveguides. In order to solve above problem, a guided-wave silicon optical bench (GW-SiOB) with silicon-based 45° reflector is proposed to develop the non-coplanar integrated lightwave circuit in this research. However, the high frequency transmission line with 10 GHz and 25 GHZ will be also developed on GW-SiOB, and integrated with the vertical cavity surface emitting laser (VCSEL) and photo-detector (PD). The objectives of this 3-year research proposal are composed of: (i) The design for the integrated SiOB with 45° reflector and polymer waveguide and its fabrication process development; (ii) 1-channel × 25-Gbps optical intra-chip modules development; (iii) 4-channel × 10-Gbps optical intra-chip modules development; In addition, the following technologies would be also addressed in this research: the optical design, the design of high frequency transmission line, the mems fabrication technology of semiconductor, and the precision packaging technology. Based on this proposed the intra-chip optical interconnects based on silicon optical bench with polymer waveguides, this optoelectronic chip could not only monolithically integrate the lightwave circuits, but also be integrated with VCSEL, PD, and ICs; therefore, a high-speed optical interconnect and intelligent system-on-chip (SOC) functionalities could be realized within a single chip. 研究期間：10008 ~ 10107
關聯:	財團法人國家實驗研究院科技政策研究與資訊中心
显示于类别:	[光電科學與工程學系] 研究計畫

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