Nucleation and propagation of voids in microbumps for 3 dimensional integrated circuits

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题名:	Nucleation and propagation of voids in microbumps for 3 dimensional integrated circuits
作者:	Hsu,HH;Huang,SY;Chang,TC;Wu,AT
贡献者:	化學工程與材料工程學系
关键词:	INTERMETALLIC COMPOUND;CU-SN;RELIABILITY;INTERDIFFUSION;GROWTH;JOINTS;SYSTEM
日期:	2011
上传时间:	2012-03-27 16:27:27 (UTC+8)
出版者:	國立中央大學
摘要:	The shrinking solder dimensions greatly impact the reliability of devices and increase entire failure modes. Limited solder volumes can be consumed completely and transformed into intermetallic compound (IMC) microbumps. Microvoids surface when microbumps are formed and may be attributed to a mismatch of the thermal expansion coefficient between the constituents. After thermal aging at 150 degrees C, the stress induced by the growth of IMCs relaxes and enhances propagation of the cracks along the middle of the bumps. The brittle nature of the IMC showed minimal resistance to cracks and incurred a failure mode. (C) 2011 American Institute of Physics. [doi: 10.1063/1.3671391]
關聯:	APPLIED PHYSICS LETTERS
显示于类别:	[化學工程與材料工程學系 ] 期刊論文

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