Development of a Mini Liquid Cooling System for High-Heat-Flux Electronic Devices

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题名:	Development of a Mini Liquid Cooling System for High-Heat-Flux Electronic Devices
作者:	Yang,CY;Liu,WC
贡献者:	機械工程學系
关键词:	TECHNOLOGIES;EXCHANGERS
日期:	2011
上传时间:	2012-03-27 17:06:31 (UTC+8)
出版者:	國立中央大學
摘要:	This study incorporated the authors' previously published micro heat exchanger with a newly designed micro pump to develop a high-performance, mini size liquid cooling system. An integrated pump and cold-plate assembly was also developed for further reducing the overall size of the system. The test results show that the micro pump provides a higher maximum pressure head and maximum flow rate in comparing to the performance of the commercial products. The performance of the entire liquid cooling system is similar to that of the recently announced product. The present study shows an optimum combination of a slim cold plate and a high-pressure-head micro pump. It provides a comparable thermal resistance but much smaller size and therefore lower cost than most of the commercial liquid cooling systems.
關聯:	HEAT TRANSFER ENGINEERING
显示于类别:	[機械工程學系] 期刊論文

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