軟體模組化度量之實驗與驗證;Experimental Validation of Software Modularization Metrics

NCUIR > College of Electrical Engineering & Computer Science > Software Engineer > Electronic Thesis & Dissertation > Item 987654321/54341

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/54341

Title:	軟體模組化度量之實驗與驗證;Experimental Validation of Software Modularization Metrics
Authors:	郭榮智;Kuo,Jung-chih
Contributors:	軟體工程研究所
Keywords:	軟體;驗證;度量;模組化;software;experimental validation;modularization;metrics
Date:	2012-07-28
Issue Date:	2012-09-11 18:48:20 (UTC+8)
Publisher:	國立中央大學
Abstract:	由於物件導向方法越來越廣泛被使用在軟體開發上，所以如何測量物件導向軟體的品質變成為了重要課題，目前已經有非常多的測量物件導向軟體的metrics被提出來，也有metrics提供如何測量模組與模組之間的關連程度，像是MQ、IC和AC等。但是這些被提出來測量模組之間關係的metrics大多數沒有經過open source軟體來做測試，也沒有實驗性的驗證與說明，本篇論文針對MQ、IC和AC等提供測量modularization quality的metrics做了實驗分析，透過四十四個Eclipse專案，驗證這些metrics與fix response time和defect density之間不具有明顯的相關性，最後利用統計的方法來說明與解釋實驗結果。Nowadays, object-oriented design approach is widely used in software development. Therefore, how to measure the quality of object-oriented software has become an important issue. Recently, metrics have been proposed to measure modularization quality of object-oriented software, such as MQ, IC, and AC. However, there has been little work on validating these metrics by applying them to popular open-source software systems. In this work, we validated the correlation between the metrics and fix response time or defect density, respectively. Through the experiment on forty-four open source Eclipse projects, we showed that there are no obvious correlations between MQ/IC/AC metrics and fix response time or defect density, respectively.
Appears in Collections:	[Software Engineer] Electronic Thesis & Dissertation

Files in This Item:

File	Description	Size	Format
index.html		0Kb	HTML	822	View/Open

社群 sharing

Loading...