以1 × 2垂直分岔高分子聚合物光路實現單晶片20-Gbps矽基光學連接模組; Chip-Level 20-Gbps Optical Interconnect Modules with Polymer-Based 1 × 2 Vertically Optical Splitters Realized on Silicon Substrate

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题名:	以1 × 2垂直分岔高分子聚合物光路實現單晶片20-Gbps矽基光學連接模組;Chip-Level 20-Gbps Optical Interconnect Modules with Polymer-Based 1 × 2 Vertically Optical Splitters Realized on Silicon Substrate
作者:	朱騰漳;Jhu,Teng-Jhang
贡献者:	光電科學與工程學系
关键词:	波導;高分子聚合物;光聯接;polymwer;waveguide;optical interconnect;on-chip
日期:	2013-08-13
上传时间:	2013-10-08 15:12:26 (UTC+8)
出版者:	國立中央大學
摘要:	本論文提出一個具有1  2分光能力的矽基光連接模組。此模組利用45微反射面達成光訊號垂直耦合，並透過高分子聚合物波導和擁有3個45微反射面的矽基板整合，實現垂直耦合、分岔光路雙輸出的矽基光學平台。利用覆晶封裝製程，在發射端和兩個輸出端封裝主動元件，完成具有收發端的光連接模組。此光連接模組具有垂直光學耦合能力、1  2雙輸出分光器、發射端和接收端，為一完整的晶片上光連接模組。此光連接模組的光學耦合效率兩輸出通道分別是23.73%和23.53%，模組總損耗為-3.26dB。輸入訊號10GHz的高頻量測結果，雙輸出通道的眼高皆約有250mV，並且通過誤碼率測試，皆低於10-12等級，證明本研究架構具有雙輸出通道單晶片20-Gbps的資料傳輸能力。 In this thesis, A polymer waveguide monolithically integrated with three Si-based 45° reflectors realized on a Si substrate is proposed to form a 1 × 2 vertically optical splitter. A VCSEL chip at the input port and two PD chips at two output ports are flip-chip assembled. In this thesis, we propose an intra-chip 10-Gbps optical interconnect module using a silicon optical bench (SiOB) integrated with polymer waveguides and silicon-based 45? micro-reflector. This optical connection module optical coupling efficiency at two output channels of 23.73% and 23.53%, and the total optical insertion loss of 3.26 dB with a splitting ratio of 1:1 is obtained for the proposed splitter. The clear eye patterns with a transmission rate of 10 Gbps at two output ports are demonstrated and verify that the 1 × 2 vertical splitter is suitable for the optical interconnects with multiple output ports. The 10-Gbps error-free performance of receiver side is also achieved at the level of 10-12 even the VCSEL is biased at 5 mA.
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