本論文主要在發展奈米材料應用在散熱技術之設計方法，由於傳統的量測方法無法非破壞性直接測量晶片內層溫度，而且紅外線熱像儀所測得之溫度只能一個局部表面溫度，不易得知晶片內層實際的溫度，本論文提出經由材料的熱傳導係數或者材料特性來計算出內部晶片溫度。量測方法為使用熱傳導原理以及等溫度曲線的特性，轉換等效電路方法計算出LED內部的實際溫度分佈，在恆溫裝置的環境下量測以提高準確度，由數位電源供應器提供電壓及電流，用熱電偶搭配NI CompactDAQ資料截取器長期取得多點電壓值，然後將數據記錄至 LabVIEW圖形化程式設計平台，以自己撰寫的LabVIEW程式將數據轉換成攝氏溫度並記錄，可簡化大量的運算過程以及計算的誤差。 由實驗可知，同樣時間內，液態奈米散熱材料與銀膠溫度相差約2℃，和粉狀奈米散熱材料溫度相差約4℃，所以液態奈米散熱材料有良好的傳導性及對流效果強，而粉末奈米材料因呈現不規則排列，導致傳導效果差，銀膠雖然傳導性佳，但無法液態化對流傳熱。最後，運用液態奈米散熱材料特性，並將它做為傳熱載子是一大突破，且液態奈米散熱材料對流效果強、傳熱性能良好，故可增加LED的傳熱效果。 液態奈米材料搭配本論文所提之監測系統不但能提升熱傳導性能、增加熱傳導系數、成本降低、亦能直接計算出內部晶片溫度。未來可以發展成3D的溫度量測系統，應用在封裝IC業。並證實了本系統在結合熱傳導理論、材料特性後確實可以得到內部晶片實際溫度，也將系統升級成一套誤差小、快速計算溫度的量測系統。This thesis is mainly focused on developments of new technology of thermal dissipation design and measurement using nano-materials, as traditional methods of temperature measurement are not direct non-destructive ways measuring the inner temperature of the chip, and it’s not easy to know the real inner chip temperature using infra-red thermal imager since only temperature of partial surface can be measured. In this thesis we put forward a new method to calculate the internal chip temperature via thermal conductivity or property of materials. The actual internal LED temperature distribution is calculated by using of heat transfer principles such as characteristics of isothermals, as well as conversion to the equivalent circuit. Experimental data are measured in constant temperature environment to improve the accuracy of measurements. Voltages and currents are provided via the digital power supply. Long-term multi-point voltages values are recorded via thermocouple combined with NI CompactDAQ data interceptor, and then are inputted to a LabVIEW graphical programming platform and are finally converted to Celsius temperature data with a LabVIEW program developed by the author which simplifies the process of complex computing as well as reduces the calculation error. During the experiment of the effect of thermal dissipation, we found that within the same period of cooling time, liquid nano- materials are better than silver conductive plastics by a temperature difference of about 2℃, and better than nano-powder materials by a temperature difference of about 4℃. So the liquid nano-materials are with better heat conductivity and convection, and nano-powder materials are with poorer performances as a result of irregular arrangement. Although silver conductive plastics are good in heat conductivity, they are poorer in heat convection. It’s a major breakthrough in nano-technology using nano-liquid materials as the heat carriers to increase the effect of heat dissipation of LED. Nano-liquid materials with the temperature monitoring system mentioned above will not only enhance the heat transfer performance, increase the thermal conductivity, lower the costs, but can also directly calculate the internal chip temperature. This technique can be developed into a 3D temperature measurement system used in IC packaging industry in the future. We also confirmed that the actual temperature within the chip can be measured by the combination of heat transfer theory and the material properties. This system will be upgraded into a small error, rapid calculation system of the temperature measurement.
