以矽中介層架構設計用於4通道 * 25-Gbps光連接模組之接收端光學次系統組裝;Design of Receiver Optical Sub-Assembly for 4-channel * 25-Gbps Optical Interconnect Module using Silicon Interposer Structure

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/71550

Title:	以矽中介層架構設計用於4通道 * 25-Gbps光連接模組之接收端光學次系統組裝;Design of Receiver Optical Sub-Assembly for 4-channel * 25-Gbps Optical Interconnect Module using Silicon Interposer Structure
Authors:	陳瑋晏;Chen,Wei-Yan
Contributors:	光電科學與工程學系
Keywords:	矽;光連接
Date:	2016-07-27
Issue Date:	2016-10-13 13:16:04 (UTC+8)
Publisher:	國立中央大學
Abstract:	本論文提出以矽光學平台為核心，設計具嵌入式高分子聚合物波導光連接模組之接收端次系統組裝，模組傳輸速度為4通道  25-Gbps。光訊號透過高分子聚合物波導的傳遞，經過矽光學平台上的45反射面轉折耦合進光偵測器，再由高頻傳輸線將電訊號導出。此模組是以應用於版與版或晶片與晶片之間的光學連接為設計初衷。在模擬結果中，整體光路的耦光效率效率為26.1%，且以-1 dB作為光學耦合效率容忍範圍，高分子聚合物波導及光偵測器的位移容忍度皆在17 m以上。各通道間的光學串音皆在-40 dB以下。高頻傳輸線在工作頻率為0.1~62.5GHz的情況下，實際量測結果反射損耗在14 dB以上，插入損耗在0.4 dB以下。;In the thesis, we designed a receiver optical sub-assembly for optical interconnect combined with polymer waveguides based on silicon optical bench. The transmission speed of receiving module is 4 channel  25-Gbps. Optical signal is transferred within polymer waveguides and steered by 45 reflector coupling into photodetecter(PD). And then electrical signal is exported by high speed transmission line. The receiving module can be apply to board to board or chip to chip optical interconnect. In simulate result, the optical coupling efficiency of system is 26.1%. And the -1 dB alignment tolerances for both polymer waveguides and PD are larger than 17 m. The inter-channel optical crosstalk are lower than -40 dB. The measured return loss is higher than 14 dB and insertion loss is lower than 0.4 dB woth the high speed transmission line works in 0.1 ~ 62.5GHz.
Appears in Collections:	[Graduate Institute of Optics and Photonics] Electronic Thesis & Dissertation

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