銀線封裝銲接參數之最佳化分析;Optimization analysis of silver wire package bonding parameters

NCUIR > Engineering College > Executive Master of Mechanical Engineering > Electronic Thesis & Dissertation > Item 987654321/72375

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/72375

Title:	銀線封裝銲接參數之最佳化分析;Optimization analysis of silver wire package bonding parameters
Authors:	巫正奎;Wu,Cheng-Kuei
Contributors:	機械工程學系在職專班
Keywords:	銲線;多重品質;TOPSIS法;灰關聯法;bonding wire;multiple quality;TOPSIS method;gray association analysis
Date:	2016-08-01
Issue Date:	2016-10-13 14:51:01 (UTC+8)
Publisher:	國立中央大學
Abstract:	封裝導線銲線技術已是行之有年的電器連接技術，大量用在微電子構裝領域，面對高密度、複雜化、微型低價化隨身型產品，都需要構裝技術來搭配。一般產業以接近純金4N之線材（99.99%）做為封裝導線，但隨著黃金價格自2001年的每盎司255美金上升至2011年最高時的每盎司1900美金，這對於使用純金線做為封裝導線主要材料的產業而言，因原物料大漲造成生產成本提高及利潤下跌。為了擺脫材料成本大幅上漲的困境，封裝廠開始改用銅線取代純金線。然而，銅線易氧化及不易貯存，且在銲線過程需使用惰性氣體；另一方面因為銅線的強度與硬度較高，使其銲線作業遭遇到參數較窄、速度較慢及良率較差的極大困難，也限制了銅線在電子封裝產業的普及性。銀的價格雖比銅來得高，卻比金來得低廉，亦無銅線易氧化及強度與硬度過高的問題，在銲線製程中，是一種新穎的線材材料。在進行銲線作業時，因打線機可調整的參數眾多而且繁雜，故為了縮短銲線時機台參數調整時間，讓銀導線與基板間有更佳的接合性，可降低後續製程發生不良的機率。本研究以2N銀導線（99%）線徑0.8 mil為主題，在線材退火清潔烘烤後，參照田口直交表以真空時間與銲線參數為因子，於銲線後對銀導線與基板間之接合性進行拉力及推球測試，並應用TOPSIS法對實驗組合作多重品質優劣排序，再藉由灰關聯法求解最佳實驗參數，並利用統計分析軟體內預測SN比功能進行結果預測與比較，已驗證並取得最佳製程參數。 ;Packaging wire bonding technology has been around for ages, is electrical connection technology, widely used in the microelectronics field, facing high density, complexity, small size of portable low-cost products, we need to implement mounting technology to match. General industry use material which is close to gold 4N (99.99%) as a package lead wire, but with the price of gold per ounce from USD 255 in 2001, rose to the highest in 2011 at USD 1900 per ounce, which result in manufacturing cost increase and profit goes down for the industry which use pure gold as main packaging wire. In order to get rid of the sharp rise in the cost of material, packaging factory began to replace gold wire by copper wire. However, copper is easily oxidized and difficult to store, and in the wire bonding need to use an inert gas; on the other hand because of the higher strength and hardness of the copper wire make wire bonding operation parameters encountered narrower, slower and yield high defect rate, above also limits the copper wire in the electronics packaging industry popularity. Although the price of silver is higher than copper, but lower than gold. Silver don’t has the nature of Copper easily oxidized, too high strength and hardness. In the packaging wire bonding process, Silver play the new role of wire material. During wire work, wire machine with lots of complicated parameters can be adjusted. In order to shorten the time to adjust parameters of wire machine, let silver wire and the baseboard has a better bonding, which can reduce the possibility of defect rate on following process. In this study, 2N silver wire (99%) 0.8 mil diameter as the theme, after the wire annealing, cleaning, baking, referring Taguchi orthogonal arrays, using vacuum time and wire parameters as factors, after wire bonding, pointing at bondability between silver wire and base board, perform tensile test and push ball test, and the application with TOPSIS for experimental cooperation merits of multiple quality sorting, and then by gray correlation method for solving the optimal experimental parameters, using statistical analysis software within the SN ratio prediction function to predict and compare the results, verify and obtain the best process parameters.
Appears in Collections:	[Executive Master of Mechanical Engineering] Electronic Thesis & Dissertation

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