本研究旨在建立一套非破壞性、非接觸式的矽膠封裝之發光二極體內部晶片溫度的量測系統。此系統依據偵測器接收穿過光學系統的物體輻射出的能量，並藉由物體輻射公式搭配能量傳播理論來反推出物體本身溫度值。以此量測方法量測自製矽膠封裝發光二極體的晶片，並改動不同放射率、不同溫度和不同矽膠厚度三個參數來得到量測系統量值所造成的影響。將影響對參數做數據處理和方程式擬合，能寫出量測系統量值對溫度的方程式，最終以另一量測溫度方法來量測同一物體的溫度來驗證此系統量測之溫度準確性。;This study aims to establish a non-destructive and non-contact system to measure the temperature of a light-emitting diode (LED) chip packaged by silicone. In the system, a detector would receive energy radiated from a LED packaged by a self-made silicone rubber after passing through the optical system. By measuring the radiated energy under varying parameters such as the emissivity of the chip, the temperature of the chip, and the thickness of silicone, the correlation between the measured energy and the aforementioned parameters can be constructed empirically, and based on which the chip temperature of a LED sample can thus be determined directly from a radiation measurement. Finally, by applying the material radiation formula and the theory of energy propagation, the temperature measurement accuracy of the system would be verified through a comparison to other measurement method.
