隨著發光二極體（LED） 技術不斷的精進，追 求厚度薄、質量輕，因此晶片級封裝（CSP）發光二極體；是目前發展的重點。而CSP LED為了達到縮小封裝體積大小且維持原有功能，已發展將發光二極體使用倒裝晶片的製程。目前最常使用的製程為螢光片式，將螢光片利用矽膠與高密度的倒裝晶片做貼合，烘烤完成後切割將可完成作業。而在LED CSP製程中目前業界主要就是以螢光片貼合方式進行。 本論文研究中，以現有倒裝晶片的量產水準可靠度75%為基準進行改善，利用田口玄一的田口方法，透過直交表及相關文獻，找出刀具壓力、刀具銳利度及切割平台溫度等三個影響可靠度的主要控制因子，並利用田口法有條理的方式進行分析，最後再依業界常用的可靠度測試條件進行最終結果確認。 藉由本研究得到的最佳參數組合為:刀具壓力0.5Mpa、刀具銳利度17°、切割平台溫度130℃，實驗結果，可靠度較原割切方式提升了3%，可靠度也由目前量產的80%提高至83%。 ;Light emitting diode （LED） technology and the pursuit of thin thickness and light weight, the chip scale package （CSP） LED is currently the focus of development. In order to reduce the package size and maintain the original function, the CSP LED has developed a process of using a flip chip for light-emitting diodes. At present, the most commonly used process is a fluorescent film type. The fluorescent sheet is made of silicone and a high-density Flip chip, and cutting is completed after the baking is completed. In the LED CSP process, the industry is currently mainly engaged in fluorescent film. In this paper, the improvement is based on the current Flip chip production level reliability of 76 to 80% （product specification is center value 78%, lower limit value 75%）, Taguchi Genota′s Taguchi is used. Methods: Through the orthogonal tables and related literature, three key reliability factors, such as tool pressure, tool sharpness, and cutting platform temperature, were identified. They were analyzed using the Taguchi method in an organized manner and finally relied on in the industry for reliability. The Reliability Analysis （RA） condition confirms the final result. The best combination obtained by this study is: tool pressure 0.5Mpa, tool sharpness 17°, cutting platform temperature 130°C. The experimental results show that the reliability is improved by 3% compared with the original cutting method, and the reliability is also from the current 80% of volume production increased to 83%.
