本論文利用LS-DYNA軟體來分析行動電話在落下實驗時外殼卡勾受力的幾何變化，並進而做最佳化分析與設計改善。本論文分為兩個主題：(1)利用Box-Behnken實驗設計方式進行三因子模擬實驗設計，研究落下實驗中卡勾的變形量及是否會造成卡勾脫落，及(2)由模擬實驗結果再進行最佳化分析，找出落下實驗後可避免卡勾脫落之最小參數值，進而得到卡勾設計最佳化尺寸。 本論文之研究結果可供給業界手持式行動裝置機構設計工程師於機構設計上的分析與參考，並藉由開模前進行LS-DYNA的模擬可早期發覺問題並縮短開發週期與降低研發成本。 ;This paper made the use of LS-DYNA to analyze the deformations taken place on the shell hooks in a cellphone drop test as well as to optimize designs based on the results obtained. The two topics discussed in this paper are: 1. To determine, with the use of Box-Behnken test, whether the deformation of hooks will lead to parts falling off 2. To optimize the design to avoid parts from detaching in the drop test The purpose of this paper is to assist mobile phone engineers to better understand the mechanical design with analyzed data and content provided within. It also serves an ultimate goal of helping corporations, with the use of LS-DYNA, to spot potential problems prior to making moulds in order to reduce extra R&D costs as well as lead time issues.
