本研究藉由濕式蝕刻法，在PI基板上蝕刻出30 μm之圓孔，並探討水刀擺動次數、界面活性劑浸泡時間、水刀前後的浸泡腐蝕液時間及水刀壓力對PI蝕刻之影響。 本研究結果顯示：(1) 當水刀擺動次數增加時，PI基板接觸水刀蝕刻時間增加，能使蝕刻深度增加，但側向蝕刻範圍也隨之變寬。(2) 界面活性劑能增加PI基板的表面能，使表面更具親水性，當表面越具親水性能使腐蝕液更有效浸潤至微孔中。(3) 水刀蝕刻前的浸泡腐蝕液作用，有軟化PI效果，以利後續水刀蝕刻；水刀蝕刻後的浸泡腐蝕液過程，讓剩餘在微孔中的PI完全溶解。(4) 在PI基板開孔需有一個蝕刻正向力，但水刀壓力增加也同時加快PI的側向蝕刻。 ;This work presents the effects of swinging times, surfactant immersion time, corrosion solution immersion time and the pressure of water jet cutting on the PI film in order to fabricate a through hole with a diameter small to 30μm via wet-etching technology. The results are described as follows. First, the depth of etching pore becomes deeper with the increase of swinging times of water jet cutting, meanwhile the diameter of etching pore becomes broaden. Second, surfactant increases the surface energy and hydrophilicity of PI substrates, immersing the pores into corrosion solution more effectively. Finally, the immersion process before water jet cutting softens the PI substrate, thus retaining more etching solution inside the pore and facilitating the dissolution process. Forth, even with a forward force through the pore, the lateral etching becomes more obvious with the increase the jet cutting pressure.
