10Gb/s MM XFP光收發模組設計與實現; Design and Implementation of 10Gb/s MM XFP Optical Transceiver

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Title:	10Gb/s MM XFP光收發模組設計與實現;Design and Implementation of 10Gb/s MM XFP Optical Transceiver
Authors:	郭三清;San-Ching Kuo
Contributors:	通訊工程研究所碩士在職專班
Keywords:	XFP光收發模組;XFP Optical Transceiver
Date:	2009-01-12
Issue Date:	2009-09-22 11:22:37 (UTC+8)
Publisher:	國立中央大學圖書館
Abstract:	本論文研討應用於光纖通訊10Gb/s MM XFP光收發模組的設計與特性測量。光收發模組是由光發射器與光接收器兩個部份所組成，光發射器由雷射驅動IC、Equalizer plus CDR與850nm垂直共振腔面射型雷射(Vertical Cavity Surface Emitting Lasers, VCSEL)的光發射次模組(Transmitter Optical Sub-Assembly，TOSA)組成，而光接收器則是由限幅放大器與850nm 檢光二極體的光接收次模組(Receiver Optical Sub-Assembly，ROSA)所組成。在光收發模組的設計上，除了元件特性的選擇外，印刷電路板的Layout技巧及傳輸線特性阻抗設計也都會影響到模組的效能。另外還有電磁干擾和串音問題也都需要考慮進去，如此才能得到較佳的模組設計。 In this thesis, the fabrication and performance of the 10Gb/s MM XFP optical transceiver modules applied in optical communication network are discussed. The optical transceiver modules consist of transmitter and receiver. The transmitters are composed by laser driver IC, Equalizer plus CDR and 850nm VCSEL (Vertical Cavity Surface Emitting Lasers) laser, where the receivers are composed by limiting amplifier IC and 850nm ROSA (Receiver Optical Sub-Assembly). In the design of optical transceiver modules, the efficiency of modules will be affected not only by the option of the properties of components but also the layout techniques of PCB and the impedance design of transmission line. Besides, we also have to consider the EMI and crosstalk problems, therefore, the design will be perfect.
Appears in Collections:	[Executive Master of Communication Engineering] Electronic Thesis & Dissertation

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