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    請使用永久網址來引用或連結此文件: http://ir.lib.ncu.edu.tw/handle/987654321/84369


    題名: 超音波輔助磨削AGC玻璃加工之研究;An investigation of ultrasonic assisted grinding on AGC glass
    作者: 張竣傑;Chang, Jun-Jie
    貢獻者: 機械工程學系
    關鍵詞: 磨削;超音波輔助;AGC玻璃;Grinding;ultrasonic assist;AGC glass
    日期: 2020-08-18
    上傳時間: 2020-09-02 19:13:23 (UTC+8)
    出版者: 國立中央大學
    摘要: 本研究利用超音波輔助磨削AGC玻璃,進行一系列加工參數實驗,並探討各加工參數對加工品質特性之影響,本研究採用於磨削加工時,藉由超音波振動刀具之方式進行,探討各種磨削加工參數如超音波功率等級、進給速度、切削深度及主軸轉速等對於AGC玻璃之各種加工特性影響,加工品質特性包含表面粗糙度、加工深度與出口碎裂情形,希望獲得較小表面粗糙度與出口碎裂以及較精確之加工深度。另使用SEM、顯微影像量測儀及共軛焦雷射掃描顯微鏡進行試件表面微結構觀察,以及利用SEM及EDX分別進行加工後磨輪表面微結構觀察與成份分析。
    實驗結果顯示,利用超音波輔助磨削加工玻璃時,超音波振動會使加工後之玻璃表面脆性破裂凹坑減少,並產生延性磨削痕跡,而根據參數實驗結果顯示,在超音波功率Level 2、進給速度50mm/min、切削深度0.005mm及主軸轉速8000rpm之參數組合下,可獲得最佳表面粗糙度Ra 0.548μm、較小之出口碎裂及較精確之加工深度。利用SEM進行加工後磨輪表面微結構觀察,可得知磨輪上的磨粒在加工時脫落,產生磨輪磨耗現象,另透過EDX元素成份分析,在加工後磨輪表面未發現有殘留加工之玻璃碎屑在其中。
    ;In this study, ultrasonic-assisted grinding was applied on AGC glass to conduct a series of processing parameter experiments and to discuss the influence of various grinding parameters on machining quality characteristics. This research was carried out by ultrasonic vibration tools to grind the AGC glass. Various grinding processing parameters such as ultrasonic power level, feed rate, cutting depth and spindle speed on grinding AGC glass were discussed. Several machining characteristics, including surface roughness, processing depth and outlet chipping, were measured, observed discussed. The lower surface roughness, outlet chipping and more precise processing depth can expect to be obtained. In addition, the microstructure of the specimen surface was observed with SEM and confocal laser scanning microscope. The microstructure of the grinding wheel surface was also observed with SEM and EDX to analyze the composition after machining grinding processes.
    The experimental results show that ultrasonic vibration can reduce brittle fracture surface pits and produce ductile grinding marks when conducting ultrasonic assisted grinding. The results also show that the best surface roughness Ra 0.548 μm, smaller outlet chipping and more precise processing depth can be obtained under ultrasonic power level 2, feed rate 50 mm/min, cutting depth 0.005 mm and spindle speed 8000 rpm. By means of the observation of the grinding wheel surface after grinding processes with SEM. The tool wear is due to abrasive particles of the grinding wheel fallen off during the process. In addition, no glass debris were found on the surface of the grinding wheel after machining grinding through EDX element composition analysis.
    顯示於類別:[機械工程研究所] 博碩士論文

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