相較於傳統工業的減法製造，近年來流行的加法製造，如 3D列印、3D金屬打印等也越來越為人所知。而在半導體業中，這種加法製造更是應用於更精密的地方，如電子元件的金屬化封裝製程，其精度涵蓋奈米到微米之間。而本實驗利用了其中常使用的局部電化學沉積技術。 本實驗承襲了學者Wang[14]於「異軸式雙螺旋演算法」上使用的基礎演算法，利用即時影像引導的局部電鍍方法來進行鍍出銅柱的柱徑控制。為了達到控制柱徑的目標，使用脈衝寬度調變PWM(Pulse Width Modulation)來模擬不同電壓電鍍的效果。 為了能讓使用者自行設定鍍出的柱徑，本實驗設計了自動調整演算法，抓取由相機回傳的影像進行影像處理，讓獲得的柱徑資料可以控制陽極放電的PWM電壓，使柱徑調整至與輸入值相仿。過程中使用自動記錄程式記錄下過程，分析不同電壓下鍍出的柱徑大小，這些資料可作為往後的電鍍目標值參考 ;此外記錄的不同控制參數之下的柱徑變化，可以分析不同參數之下的誤差，來使電鍍達到更好的表現。 ;In recent years, additive manufacturing has become more popular than traditional subtractive manufacturing. 3D printing, 3D metal printing, etc. are becoming more and more known. In the semiconductor industry, the application of this additive manufacturing is applied to more precise places. For example, the accuracy range of the electronic components metallization packaging process is from nanometers to micrometers. This experiment uses the local electrochemical deposition technology commonly used among them. This paper is based on the basic algorithm of the "non-coaxial double-helix algorithm." Use the local electroplating method guided by a real-time image to control the plated copper column diameter. PWM (Pulse Width Modulation) is used to simulate the effect of electroplating with different voltages to achieve the goal of controlling the column diameter. This experiment designed an automatic adjustment algorithm to capture the image returned by the camera for image processing to set the plated column′s diameter. Therefore, the returned column diameter data can automatically adjust the PWM of the anode discharge through voltage changes to make the column diameter similar to the input value. Using an automatic recording program to record the process can let us analyze the size of the column diameter plated under different voltages, which can also be used as a reference for the plating target value in the future. It can also record the difference of column diameter under different control parameters to analyze the error and make the electroplating achieve superior performance.
