白光與紅外混合封裝之 mini LED 陣列與其應用於自駕車頭燈之研究;White light and infrared hybrid packaging for mini-LED arrays and its application in autonomous headlights

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/92463

Title:	白光與紅外混合封裝之 mini LED 陣列與其應用於自駕車頭燈之研究;White light and infrared hybrid packaging for mini-LED arrays and its application in autonomous headlights
Authors:	陳美霖;Chen, Mei-Lin
Contributors:	光電科學與工程學系
Keywords:	汽車車前燈;LED 封裝;LED 陣列;紅外光;光學設計;Automotive headlights;LED packaging;LED packaging;infrared light;optical design
Date:	2023-08-17
Issue Date:	2024-09-19 15:52:58 (UTC+8)
Publisher:	國立中央大學
Abstract:	本論文中，我們對汽車車頭燈的設計提出一個全新的光學設計概念，此光學系統將近光燈與遠光燈結合可見光波段及紅外光波段，近光燈為可見光，可用於駕駛人之路面照明，而遠光燈使用 850nm 之紅外光，由對向來車感測器所接收，並且以 ECE R112 歐洲車輛安全檢測法規之光型為設計。在光源的選擇上，以多晶單一封裝形式方式進行設計，使每個晶片彼此之間的間距更加靠近，因此同等級的晶片而言，整體晶片的光展量會更小，這將利於後續的光學設計，並且針對 LED 陣列晶片進行分群點亮，利用不同點亮位置的晶片，產生不同的能量分佈達到不同的需求與法規;In this thesis, we propose a novel optical design concept for automotive headlights. This optical system combines low beam and high beam functions in both the visible light and infrared light spectra. The low beam employs visible light for road illumination, while the high beam uses 850nm infrared light, which is detected by oncoming vehicle sensors and designed according to the ECE R112 vehicle safety regulations for light patterns. The light source selection is based on a multi-chip single-package design, with the advantage of reducing the spacing between each chip. As a result, the overall chip footprint is smaller for the same chip grade, facilitating the subsequent optical design. Moreover, we apply LED array chip grouping and illumination at different positions to achieve various energy distributions, meeting diverse requirements and regulations. Keywords: Automotive headlights, LED packaging, LED array, infrared light, optical desig
Appears in Collections:	[Graduate Institute of Optics and Photonics] Electronic Thesis & Dissertation

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