隨著顯示器技術的演進，較高階的顯示器逐漸採用微型發光二極體(MiniLEDs 與 Micro LEDs)，以直接發光的方式呈現影像和文字，提高對比度和更寬廣的視角，但在製程中也面臨一些挑戰，致使製造成本仍居高不下，挑戰之一來自直接於顯示面板焊合尺寸較小、排列緊密的 Mini LED 和 Micro LED。目前市面上有兩種主要的焊接技術：回焊爐與熱壓焊接技術。這兩種製程的限制是元件與電路載板須有較高的耐熱度，同時要面臨焊接時間冗長、晶片載板因熱膨脹率不同易導致尺寸失準、翹曲和持溫過程的高能耗等問題，造成良率下降和設備製造成本也居高不下，並且在焊接過程中的能耗和廢熱排放很大，難以實現淨零碳排的 ESG 永續目標。本研究以雷射轉印之方式將錫膏進行高精度之定量轉印，以解決傳統網印塗佈方法無法轉印尺寸過小錫膏的問題。藉由自行設計之機構，發揮雷射高度圖案化優勢，以達定量錫膏焊料轉印之目的。;As display technology evolves, higher-end displays are gradually adopting Mini LEDs and Micro LEDs to directly emit light for images and text presentation. This approach enhances contrast and widens viewing angles. However, the manufacturing process faces challenges that keep production costs elevated. One challenge arises from the small and densely arranged sizes of Mini LEDs and Micro LEDs directly soldered onto the display panel. Currently, there are two main soldering techniques on the market: reflow soldering and thermal compression bonding. Both processes require LED devices and circuit boards with high-temperature resistance. They also suffer from issues such as extended soldering times, potential misalignment due to differing coefficients of thermal expansion between chip and board, warping, and high energy consumption during temperature holding. These factors lead to decreased yield rates and elevated equipment manufacturing costs. Moreover, substantial energy consumption and waste heat discharge during the soldering process hinder the achievement of net-zero carbon emissions in ESG sustainability goals. This study employs laser-assisted transfer to quantitatively transfer solder paste with high precision, addressing the challenge of transferring small-sized solder paste that conventional screen printing methods struggle with. Through self-designed equipment, the advantages of laser patterning are utilized to achieve the quantitative transfer of solder paste for soldering. The research explores three different solder paste transfer techniques. Subsequently, localized heating is applied to the components and substrates to accurately control heating time and area. By melting and solidifying the solder paste, the original LED devices are bonded to the circuit board, and the merits and drawbacks of the methods are discussed and compared. This study aims to minimize damage to both the devices and circuit boards caused by traditional soldering, reduce the energy and time costs associated with conventional soldering, and enhance the quality and efficiency of LED solder bonding.
