 |
English
|
正體中文
|
简体中文
|
全文筆數/總筆數 : 94459/94459 (100%)
造訪人次 : 87656699
線上人數 : 232
|
|
|
"Wu, Albert T."的相關文件
回到依作者瀏覽
顯示 31 項.
|
類別 |
日期 |
題名 |
作者 |
檔案 |
| [化學工程與材料工程學系 ] 期刊論文 |
2016-12-01 |
In Situ Electromigration in Cu-Sn and Ni-Sn Critical Solder Length for Three-Dimensional Integrated Circuits |
吳子嘉; Huang, Y. T.; Chen, C. H.; Lee, B. H.; Chen, H. C.; Wang, C. M.; Wu, Albert T. |
 |
| [化學工程與材料工程學系 ] 期刊論文 |
2016-12-01 |
Si1−xGex photodiode with segregated Ge nanocrystals |
吳子嘉; Ouyang, Yao-Tsung; Hsieh, Hsien-Chien; Lin, Po-Chen; Tseng, Tsan-Hsien; Ku, Ching-Shun; Lee, Hsin-Yi; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2016-06-25 |
Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on Co-based surface finishes |
吳子嘉; Chen, Hao; Tsai, Yi-Ling; Chang, Yu-Ting; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2016-03-21 |
Disruption of crystalline structure of Sn3.5Ag induced by electric current |
吳子嘉; Huang, Han-Chie; Lin, Kwang-Lung; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2016-01-01 |
Interfacial Reactions of Low-Melting Sn-Bi-Ga Solder Alloy on Cu Substrate |
吳子嘉; Chen, Chih-Hao; Lee, Boon-Ho; Chen, Hsiang-Chua; Wang, Chang-Meng; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2015-12-01 |
High dislocation density of tin induced by electric current |
吳子嘉; Liao, Yi-Han; Liang, Chien-Lung; Lin, Kwang-Lung; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2015-10-05 |
Evolution of the Intermetallic Compounds in Ni/Sn-2.5Ag/Ni Microbumps for Three-Dimensional Integrated Circuits |
吳子嘉; Hsu, H. H.; Huang, Y. T.; Huang, S. Y.; Chang, T. C.; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2015-10-05 |
In Situ Synchrotron X-ray Diffraction Measurement of the Strain Distribution in Si Die for the Embedded Substrates |
吳子嘉; Hsu, Hsueh Hsien; Chen, Hao; Ouyang, Yao Tsung; Chiu, Tz Cheng; Chang, Tao Chih; Lee, Hsin Yi; Ku, Chin Shun; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2015-09-15 |
Metastable Ge nanocrystalline in SiGe matrix for photodiode |
吳子嘉; Ouyang, Yao-Tsung; Su, Chien-Hao; Chang, Jenq-Yang; Cheng, Shao-Liang; Lin, Po-Chen; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2015-09-15 |
Metastable Ge nanocrystalline in SiGe matrix for photodiode |
鄭紹良; Ouyang, Yao-Tsung; Su, Chien-Hao; Chang, Jenq-Yang; Cheng, Shao-Liang; Lin, Po-Chen; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2015-01-15 |
The diminishing of crystal structure of Sn9Zn alloy due to electrical current stressing |
吳子嘉; He, Jian-Yang; Lin, Kwang-Lung; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2014-03-13 |
Back-fill Sn flux against current-stressing at cathode micro Cu/Sn interface |
吳子嘉; Liu, C. Y.; Hsu, Y. C.; Hu, Y. J.; Huang, T. S.; Lu, C. T.; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2014-03-13 |
Back-fill Sn flux against current-stressing at cathode micro Cu/Sn interface |
劉正毓; Liu, C. Y.; Hsu, Y. C.; Hu, Y. J.; Huang, T. S.; Lu, C. T.; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2014-02-10 |
Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits |
吳子嘉; Huang, Y. T.; Hsu, H. H.; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2014-01-01 |
Effect of metal bond-pad configurations on the solder microstructure development of flip-chip solder joints |
吳子嘉; Hu, Y. J.; Hsu, Y. C.; Huang, T. S.; Lu, C. T.; Wu, Albert T.; Liu, C. Y. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2014-01-01 |
Effect of metal bond-pad configurations on the solder microstructure development of flip-chip solder joints |
劉正毓; Hu, Y. J.; Hsu, Y. C.; Huang, T. S.; Lu, C. T.; Wu, Albert T.; Liu, C. Y. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2014-01-01 |
Evaluation of strain measurement in a die-to-interposer chip using in situ synchrotron X-Ray diffraction and finite-element analysis |
吳子嘉; Hsu, Hsueh-Hsien; Chiu, Tz-Cheng; Chang, Tao-Chih; Huang, Shin-Yi; Lee, Hsin-Yi; Ku, Ching-Shun; Lin, Yang-Yi; Su, Chien-Hao; Chou, Li-Wei; Ouyang, Yao-Tsung; Huang, YI-Ting; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2014-01-01 |
Kinetic analysis of spontaneous whisker growth on pre-treated surfaces with weak oxide |
吳子嘉; Su, Chien-Hao; Chen, Hao; Lee, Hsin-Yi; Liu, Cheng Yi; Ku, Ching-Shun; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2014-01-01 |
Kinetic analysis of spontaneous whisker growth on pre-treated surfaces with weak oxide |
劉正毓; Su, Chien-Hao; Chen, Hao; Lee, Hsin-Yi; Liu, Cheng Yi; Ku, Ching-Shun; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2014-01-01 |
Polarity effect in a Sn3Ag0.5Cu/bismuth telluride thermoelectric system |
吳子嘉; Chien, P. Y.; Yeh, C. H.; Hsu, H. H.; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2013-07-15 |
High surface textured SnO 2 hybrid thin films fabricated using the nozzle-spraying process for solar cell applications |
吳子嘉; Chou, Li-Wei; Lin, Yang-Yi; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2013-03-18 |
Bandgap narrowing in high dopant tin oxide degenerate thin film produced by atmosphere pressure chemical vapor deposition |
吳子嘉; Lin, Yang-Yi; Lee, Hsin-Yi; Ku, Ching-Shun; Chou, Li-Wei; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2013-03-01 |
Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress |
吳子嘉; Chen, Wei-Yu; Chiu, Tsung-Chieh; Lin, Kwang-Lung; Wu, Albert T.; Jang, Wei-Luen; Dong, Chung-Li; Lee, Hsin-Yi |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2013-02-05 |
Electrorecrystallization of Metal Alloy |
吳子嘉; Chiu, Ying-Ta; Lin, Kwang-Lung; Wu, Albert T.; Jang, Wei-Luen; Dong, Chung-Li; Lai, Yi-Shao |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2013-01-01 |
Massive spalling and morphological change of intermetallic compound affected by adding Pd in Co-based surface finishes |
吳子嘉; Hong, J.H.; Lee, H.Y.; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2013-01-01 |
Reliability of micro-interconnects in 3D IC packages |
吳子嘉; Robert Kao, C.; Wu, Albert T.; Tu, King-Ning; Lai, Yi-Shao |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2012-12-01 |
Evaluation of diffusion barrier between pure Sn and Te |
吳子嘉; Ko, Chang-Yen; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2012-12-01 |
Interfacial reactions between diffusion barriers and thermoelectric materials under current stressing |
吳子嘉; Lo, Li-Chen; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2012-01-16 |
Current redistribution by intermetallic compounds in Through-Silicon-Via (TSV) |
吳子嘉; Tsai, C.Y.; Lou, B.Y.; Hsu, H.H.; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2012-01-01 |
Elucidating the metal-induced crystallization and diffusion behavior of Al/a-Ge thin films |
吳子嘉; Yeh, Chao-Nan; Yang, Kewin; Lee, Hsin-Yi; Wu, Albert T. |
|
| [化學工程與材料工程學系 ] 期刊論文 |
2012-01-01 |
Evaluation of diffusion barrier between lead-free solder systems and thermoelectric materials |
吳子嘉; Lin, T.Y.; Liao, C.N.; Wu, Albert T. |
|
|
::: Copyright National Central University. | 國立中央大學圖書館版權所有 | 收藏本站 | 設為首頁 | 最佳瀏覽畫面: 1024*768 | 建站日期：8-24-2009 :::
