Siblings retired tests [10/10] Collection Statistics Item counts issued in 3 years: 52(11.87%) Items With Fulltext: 438(100.00%) Download counts of the item Download times greater than 0: 438(100.00%) Download times greater than 100: 433(98.86%) Total Bitstream Download Counts: 294117(97.72%) Last Update: 2024-05-31 15:27 Top Upload Loading... Top Download Loading... Recent Submissions 運用系統模擬減少半導體封裝製程時間及訂單延遲;Applying Sys... 金屬製造產業導入工業4.0之規劃與試行 -以Y公司為例 應用 QC STORY 結合 TRIZ 理論改善自動化測試良率 –以網... 層級分析法對供應商評選的研究 –以網通產業D公司為例 評選半導體設備產業供應商之研究;On the Supplier Eva... 企業制定及實踐ESG 永續發展策略之研究-以台積電為例;On the ... 以實獲值管理提升國防專案收入認列品質及可靠性 包裝材料供應商評選之研究 -以半導體封測產業為例;Evaluation... IC載板廠ABF烤箱Stocker生產模式探討-以U公司為研究對象;I... 區域性組裝廠優化入料增加庫存管理效益-以I公司為例

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Showing items 21-30 of 438. (44 Page(s) Totally) << < 1 2 3 4 5 6 7 8 9 10 > >> View [10|25|50] records per page

Date	Title	Authors
2023-05-24	運用LSTM與RNN模型預測多點位溫度–以藥品自動化恆溫倉(AS/RS)為例;Temperature forecasting with key spots by LSTM and RNN - A case study of Pharmaceutical air-conditional AS/RS	蔡念純; Tsai, Nien-Chun
2023-01-16	運用QC STORY優化刀工具庫房管理 流程之研究-以國防武器刀工具庫房為例	陳香名; Chen, Hsiang-Ming
2023-01-13	應用AHP層級分析法於新產品專案管理關鍵成功因素之研究 -以網通產品為例;Application of AHP to study the key success factors of new product project management- A Case Study of Netcom Product	彭姿寧; Peng, Tzu-Ning
2022-08-26	應用精實生產改善影像感測之封裝製程;Applying Lean Manufacturing to Improve Packaging Processes for Imaging Sensors	徐琬鈴; Hsu, Wan-Ling
2022-08-17	運用生命週期評估醫療自動注射器之碳足跡;Using Life Cycle to Assess Carbon Footprints for Medical Autoinjectors	黃上育; Huang, Shang-Yu
2022-08-10	以設備振動資料偵測設備健康狀況-以A公司為例	范佐宇; Fan, Zuo-Yu
2022-08-08	溫度濕度運用於產品之加速壽命測試可行性評估-以Q司為例	朱珩薷; CHU, HENG-JU
2022-08-08	運用存活分析探討影響設備保養週期因子研究：以U公司為例	卓昆輝; Cho, Kun-Hui
2022-07-30	利用資料探勘方式優化PCB良率改善流程 -以C公司為例;Using data mining methods to optimize the PCB yield improvement process - An empirical study for C. corporation	江逸婷; Chiang, I-Ting
2022-07-25	生產動線規劃之改善-以D公司為例	柯政毅; Ke, Zheng-Yi

Showing items 21-30 of 438. (44 Page(s) Totally) << < 1 2 3 4 5 6 7 8 9 10 > >> View [10|25|50] records per page